A2F500M3G-FGG484I
Part Number A2F500M3G-FGG484I
Manufacturer Microchip Technology
Description IC SOC CORTEX-M3 80MHZ 484FBGA
Quantity Available 3125 pcs new original in stock.
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Datasheets 1.A2F500M3G-FGG484I.pdf2.A2F500M3G-FGG484I.pdf3.A2F500M3G-FGG484I.pdf4.A2F500M3G-FGG484I.pdf5.A2F500M3G-FGG484I.pdf
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Technical Information of A2F500M3G-FGG484I
Manufacturer Part Number A2F500M3G-FGG484I Category Industrial Controls
Manufacturer Microsemi Description IC SOC CORTEX-M3 80MHZ 484FBGA
Package / Case 484-FPBGA (23x23) Quantity Available 3125 pcs
Supplier Device Package 484-FPBGA (23x23) Speed 80MHz
Series SmartFusion® RAM Size 64KB
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Peripherals DMA, POR, WDT
Package / Case 484-BGA Package Tray
Operating Temperature -40°C ~ 100°C (TJ) Number of I/O MCU - 41, FPGA - 128
Flash Size 512KB Core Processor ARM® Cortex®-M3
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART Base Product Number A2F500
Architecture MCU, FPGA  
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Product Model

A2F500M3G-FGG484I

Introduction

Embedded System on Chip (SoC) integrating MCU and FPGA technologies.

Brand and Manufacturer

Microchip Technology

Features

Integrated ARM Cortex-M3 core processor

Supports DMA, POR, WDT peripherals

EBI/EMI, Ethernet, I2C, SPI, UART/USART connectivity options

FPGA functionality with ProASIC3 technology

Product Performance

Core speed up to 80MHz

Flash size of 512KB

RAM size of 64KB

Operating temperature range from -40°C to 100°C

Technical Specifications

Architecture: MCU, FPGA

Core Processor: ARM Cortex-M3

Flash Size: 512KB

RAM Size: 64KB

Speed: 80MHz

Dimensions, Shape, and Packaging

484-BGA package

Dimensions of package: 23x23mm

Supplied in tray packaging

Quality and Reliability

High reliability under temperature variations from -40°C to 100°C

Product Advantages

High integration of MCU and FPGA reduces complexity and board space

Flexible I/O options with 41 MCU I/Os and 128 FPGA I/Os

Product Competitiveness

Offers a unique combination of ARM processing and FPGA in a single device

Competitive in applications requiring both processing power and hardware flexibility

Compatibility

Compatible with various industrial standard interfaces and protocols

Standard Certification and Compliance

Complies with industry standard specifications for embedded systems

Lifespan and Sustainability

Designed for long-term reliability and performance in diverse environments

Actual Application Fields

Suitable for industrial, automation, and control applications

Ideal for applications requiring intensive processing and high-speed interfacing

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