ARIAT is registered to ISO9001:2008. We obtained ISO9001 registration in July 2010. Having registration demonstrates to our customers that top management is committed to providing customers with original components with the least risk of counterfeit. ARIAT can provide traceability on the commercial components sold.

Quality Policy

ARIAT is committed to gratifying and astonishing customers with our customer service excellence, order accuracy and on-time delivery. This is accomplished through our commitment to continual improvement of our processes, services, products.

Testing lab support

ARIAT will ensure all the functions are no problems before the shipment. All parts will part our QC Dep., we can supply profession testing technology. Include functions testing, Visual inspection, X-Ray inspections, Solderability Testing and Acetone erase check. Guarantee all components are no problems with the least risk to customer.

Please send your questions about quality or request for Corrective Actions to Quality. Any questions about our Quality Management System feel free to contact us. Email: Info@ariat-tech.com

Functions testing

All functions and parameters tested, referred to as full-function test, according to the original specifications, application notes, or client application site, the full functionality of the devices tested, including DC parameters of the test, but does not include AC parameter feature analysis and verification part of the non-bulk test the limits of parameters.

Visual inspection

Use of stereoscopic microscope, the appearance of components for 360 ° all-round observation. The focus of observation status include product packaging; chip type, date, batch; printing and packaging state; pin arrangement, coplanar with the plating of the case and so on.

Visual inspection can quickly understand the requirement to meet the external requirements of the original brand manufacturers, anti-static and moisture standards, and whether used or refurbished.

X-Ray inspections

X-ray inspection, the traversal of the components within the 360 ° all-round observation, to determine the internal structure of components under test and package connection status, you can see a large number of samples under test are the same, or a mixture (Mixed-Up ) the problems arise; in addition they have with the specifications (Datasheet) each other than to understand the correctness of the sample under test. Connection status of the test package, to learn about the chip and package connectivity between pins is normal, to exclude the key and open-wire short-circuited.

Acetone erase check

Private key of the device surface for printing text and icons reagent acetone wipe and re-marking inferior ink can easily be erased.