A2F200M3F-PQG208I
Part Number A2F200M3F-PQG208I
Manufacturer Microchip Technology
Description IC SOC CORTEX-M3 80MHZ 208QFP
Quantity Available 2894 pcs new original in stock.
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Datasheets 1.A2F200M3F-PQG208I.pdf2.A2F200M3F-PQG208I.pdf3.A2F200M3F-PQG208I.pdf4.A2F200M3F-PQG208I.pdf5.A2F200M3F-PQG208I.pdf6.A2F200M3F-PQG208I.pdf
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Technical Information of A2F200M3F-PQG208I
Manufacturer Part Number A2F200M3F-PQG208I Category Industrial Controls
Manufacturer Microsemi Description IC SOC CORTEX-M3 80MHZ 208QFP
Package / Case 208-PQFP (28x28) Quantity Available 2894 pcs
Supplier Device Package 208-PQFP (28x28) Speed 80MHz
Series SmartFusion® RAM Size 64KB
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Peripherals DMA, POR, WDT
Package / Case 208-BFQFP Package Tray
Operating Temperature -40°C ~ 100°C (TJ) Number of I/O MCU - 22, FPGA - 66
Flash Size 256KB Core Processor ARM® Cortex®-M3
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART Base Product Number A2F200
Architecture MCU, FPGA  
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Product Model

A2F200M3F-PQG208I

Introduction

Embedded System On Chip (SoC) integrating an MCU and FPGA

Brand and Manufacturer

Microchip Technology

Features

MCU and FPGA architecture

Integrated ARM Cortex-M3 core processor

Equipped with DMA, POR, and WDT peripherals

Supports multiple connectivity options including Ethernet, I2C, SPI, UART/USART

Product Performance

256KB of Flash memory

64KB of RAM

Operates at a speed of 80MHz

ProASIC3 FPGA with 200K Gates and 4608 D-Flip-Flops

Technical Specifications

ARM Cortex-M3 core

Flash and RAM onboard

EBI/EMI connectivity options

ProASIC3 FPGA technology

Dimensions, Shape, and Packaging

208-BFQFP packaging

28x28 PQFP device package

Quality and Reliability

Operational temperature range from -40°C to 100°C (TJ)

Product Advantages

Dual MCU and FPGA functionality for versatile applications

Advanced connectivity for enhanced interfacing

Product Competitiveness

Reliable performance from a reputable manufacturer

Compatibility

22 MCU I/Os, 66 FPGA I/Os

Supports various communication protocols

Standard Certification and Compliance

Must adhere to industry-standard certifications and compliances

Lifespan and Sustainability

Extended lifespan suitable for various embedded applications

Actual Application Fields

Used in complex embedded systems requiring both processing power and reconfigurability

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