| A2F500M3G-1FG256M | |
|---|---|
| Part Number | A2F500M3G-1FG256M |
| Manufacturer | Microchip Technology |
| Description | IC SOC CORTEX-M3 100MHZ 256FBGA |
| Quantity Available | 2621 pcs new original in stock. Request Stock & Quotation |
| ECAD Model | |
| Datasheets | 1.A2F500M3G-1FG256M.pdf2.A2F500M3G-1FG256M.pdf3.A2F500M3G-1FG256M.pdf4.A2F500M3G-1FG256M.pdf5.A2F500M3G-1FG256M.pdf |
| Download | A2F500M3G-1FG256M Details PDF |
| A2F500M3G-1FG256M Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
| Technical Information of A2F500M3G-1FG256M | |||
|---|---|---|---|
| Manufacturer Part Number | A2F500M3G-1FG256M | Category | Industrial Controls |
| Manufacturer | Microsemi | Description | IC SOC CORTEX-M3 100MHZ 256FBGA |
| Package / Case | 256-FPBGA (17x17) | Quantity Available | 2621 pcs |
| Supplier Device Package | 256-FPBGA (17x17) | Speed | 100MHz |
| Series | SmartFusion® | RAM Size | 64KB |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | Peripherals | DMA, POR, WDT |
| Package / Case | 256-LBGA | Package | Tray |
| Operating Temperature | -55°C ~ 125°C (TJ) | Number of I/O | MCU - 25, FPGA - 66 |
| Flash Size | 512KB | Core Processor | ARM® Cortex®-M3 |
| Connectivity | EBI/EMI, Ethernet, I²C, SPI, UART/USART | Base Product Number | A2F500 |
| Architecture | MCU, FPGA | ||
| Download | A2F500M3G-1FG256M PDF - DE.pdf | ||
Product Model
A2F500M3G-1FG256M
Introduction
Embedded System on Chip combining MCU and FPGA technologies
Brand and Manufacturer
Microchip Technology
Features
ARM Cortex-M3 core
ProASIC3 FPGA technology
500K logic gates
11520 D-Flip-Flops
64KB RAM
512KB Flash memory
DMA, POR, WDT peripherals
Product Performance
100 MHz clock speed
Supports high-speed interfaces like Ethernet, I2C, SPI, UART/USART
Extended temperature range from -55°C to 125°C
Technical Specifications
Core Processor: ARM Cortex-M3
Flash Size: 512KB
RAM Size: 64KB
Speed: 100MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Dimensions, Shape, and Packaging
256-LBGA package
Dimension: 256-FPBGA (17x17)
Quality and Reliability
High reliability under extended temperatures
Robust design suitable for demanding applications
Product Advantages
Integrated MCU and FPGA
High gate count and memory for complex applications
Support for multiple high-speed communication protocols
Product Competitiveness
Competes well in markets requiring high integration and performance
Optimized for power and space efficiency in embedded applications
Compatibility
Compatible with standard development tools for ARM Cortex-M3 and FPGA
Easy integration with existing technology infrastructures
Standard Certification and Compliance
Complies with industry standards for embedded systems
Reliability tested under harsh environmental conditions
Lifespan and Sustainability
Designed for long operational lifespan
Suitable for sustainable applications requiring low power consumption
Actual Application Fields
Industrial control systems
Automotive electronics
Telecommunications infrastructure
Defense and aerospace applications
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| A2F500M3G-1FG256M Image | A2F500M3G-1FG256M Picture | A2F500M3G-1FG256M PDF | |||
| A2F500M3G-1FG256M Datasheet | Download A2F500M3G-1FG256M Datasheet | Manufacturer Microsemi | |||
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