A2F500M3G-FG484
Part Number A2F500M3G-FG484
Manufacturer Microchip Technology
Description IC SOC CORTEX-M3 80MHZ 484FBGA
Quantity Available 3178 pcs new original in stock.
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Datasheets 1.A2F500M3G-FG484.pdf2.A2F500M3G-FG484.pdf3.A2F500M3G-FG484.pdf4.A2F500M3G-FG484.pdf5.A2F500M3G-FG484.pdf
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Technical Information of A2F500M3G-FG484
Manufacturer Part Number A2F500M3G-FG484 Category Industrial Controls
Manufacturer Microsemi Description IC SOC CORTEX-M3 80MHZ 484FBGA
Package / Case 484-FPBGA (23x23) Quantity Available 3178 pcs
Supplier Device Package 484-FPBGA (23x23) Speed 80MHz
Series SmartFusion® RAM Size 64KB
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Peripherals DMA, POR, WDT
Package / Case 484-BGA Package Tray
Operating Temperature 0°C ~ 85°C (TJ) Number of I/O MCU - 41, FPGA - 128
Flash Size 512KB Core Processor ARM® Cortex®-M3
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART Base Product Number A2F500
Architecture MCU, FPGA  
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Product Model

A2F500M3G-FG484

Introduction

Integrated Microcontroller and FPGA system on a chip for diverse embedded applications

Brand and Manufacturer

Microchip Technology

Features

Built-in ARM Cortex-M3 Core

Embedded ProASIC3 FPGA technology

500K Gates FPGA capacity

11520 Digital Flip-Flops

Multiple peripherals including DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART connectivity options

Product Performance

80MHz Operating Speed for efficient processing

Flash Size of 512KB and RAM Size of 64KB for program storage

High integration for better system reliability and lower power consumption

Technical Specifications

SmartFusion ® Series device combining MCU and FPGA

Operating Temperature range from 0°C to 85°C

Dimensions, Shape, and Packaging

Package/Case: 484-BGA

Supplier Device Package: 484-FPBGA (23x23)

Delivered in Tray packaging format for component safety

Quality and Reliability

Active product status indicating ongoing manufacturer support

Consistent performance across specified operating conditions

Product Advantages

High integration reduces board space and system complexity

A single-chip solution can reduce the overall system cost

Product Competitiveness

Provides a unique blend of microcontroller and FPGA on one chip

Competes in space, power, and cost efficiency with discrete components

Compatibility

Numerous interfaces and I/O for compatibility with various peripherals

Programmable I/O enables flexibility in interfacing with other components

Standard Certification and Compliance

Meets standard compliances as required by Embedded SoC industry requirements

Lifespan and Sustainability

Long-term availability supports extended product lifecycle requirements

Actual Application Fields

Suitable for industrial, automotive, consumer electronics, and communication systems

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