Welcome to ARIAT TECH
ARIAT TECH is reliable Electronics Components Distributor for IC chips and Modules. Ariat was founded in 1996. Our main advantage brands are ALTERA, Broadcom, MAXIM, ATMEL, CYPRESS, VISHAY/IR, NXP, Diodes, INFINEON, NS, TOSHIBA, Lattice, Cypress, PMC, Intersil, IDT, IXYS, Fujitsu, SEMICRON, EUPEC, MITSUBISHI, POWEREX etc. Please contact us at any time.More

Distribution Brand

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Vishay General Semiconductor – Diodes Division
TAEC Product (Toshiba Electronic Devices and Storage Corporation)
TDK Corporation
Omron Automation
Nexperia
Murata Power Solutions
Micrel / Microchip Technology
Lattice Semiconductor
IXYS / Littelfuse
Intersil (Renesas Electronics Corporation)
IDT (Renesas Electronics Corporation)
Cypress Semiconductor (Infineon Technologies)
Fujitsu Electronics America, Inc.
Diodes Incorporated
Cypress Semiconductor
Altera (Intel)

Blog & Posts

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Class X vs Class Y Capacitors: What’s the Difference?

Class X and Class Y capacitors are main parts used in electronic devices that connect to AC power. T...

ASIC vs FPGA: Which One Should You Choose?

ASICs and FPGAs are widely used chip technologies in modern electronics, each designed for different...

How to Improve Signal with High Pass Filters

High pass filters are essential circuits in electronics that help control how signals behave based o...

Ceramic vs Electrolytic Capacitors: Uses, Features, Pros and Cons

Capacitors are small components that help control voltage, reduce noise, and keep circuits stable. C...

What Is Co-Packaged Optics (CPO)? Overview, Benefits, and Applications

Co-Packaged Optics (CPO) is becoming an important technology in modern high-speed systems. As data d...

News

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Google is in talks with Marvell to develop two AI inference chips, with pilot production expected in 2027

On April 19, 2026 (local time), media reports citing sources familiar with the matter reve...

TSMC Advances Panel-Level Packaging Technology; CoPoS Pilot Line Expected to Be Completed in June

According to *The Business Times*, TSMC’s CoPoS (Chip-on-Panel-on-Substrate) pilot produc...

Anthropic Partners with Google and Broadcom to Deploy Several Gigawatts of Next-Generation TPUs

On April 6 local time, U.S. artificial intelligence (AI) technology giant Anthropic announ...

Microsoft Announces $5.5 Billion Investment to Expand Cloud and AI Infrastructure in Singapore

On April 1, Microsoft announced it would invest $5.5 billion in Singapore to continue expa...

Samsung has reached an exclusive HBM4 supply agreement with OpenAI, with the supply volume potentially accounting for 15%

Samsung Electronics will be the first to exclusively supply its next-generation HBM4 to Op...

New Products

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ST8500 Programmable PLC Modem SoC

ST8500 Programmable PLC Modem SoC STMicroelectronics' programmable system on chip (SoC) is designed ...

BALF-NRF01J5 Ultra-Thin Balun

BALF-NRF01J5 Ultra-Thin Balun STMicroelectronics' BALF-NRF01J5 50 Ω ultra-thin balun with integrate...

Bluetooth® Xpress Modules and Development Platform

Bluetooth® Xpress Modules and Development PlatformSilicon Labs’ Blue Gecko Xpress BGX13 is a wireless Xpress module specially designed to make addin...

Industrial Ethernet MagJack® ICMs

Industrial Ethernet MagJack® ICMs TRP Connector's Ethernet ICMs are designed for the industrial...

PD30 Series Photoelectric Sensor

PD30 Series Photoelectric Sensor Carlo Gavazzi’s miniature photoelectric sensors are high-performan...

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