XC3S50-4CPG132C
Part Number XC3S50-4CPG132C
Manufacturer AMD
Description IC FPGA 89 I/O 132CSBGA
Quantity Available 2763 pcs new original in stock.
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Datasheets 1.XC3S50-4CPG132C.pdf2.XC3S50-4CPG132C.pdf
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Technical Information of XC3S50-4CPG132C
Manufacturer Part Number XC3S50-4CPG132C Category Industrial Controls
Manufacturer AMD Description IC FPGA 89 I/O 132CSBGA
Package / Case 132-CSPBGA (8x8) Quantity Available 2763 pcs
Voltage - Supply 1.14V ~ 1.26V Total RAM Bits 73728
Supplier Device Package 132-CSPBGA (8x8) Series Spartan®-3
Package / Case 132-TFBGA, CSPBGA Package Tray
Operating Temperature 0°C ~ 85°C (TJ) Number of Logic Elements/Cells 1728
Number of LABs/CLBs 192 Number of I/O 89
Number of Gates 50000 Mounting Type Surface Mount
Base Product Number XC3S50  
DownloadXC3S50-4CPG132C PDF - DE.pdf

Product Model

XC3S50-4CPG132C

Introduction

FPGA Spartan-3 Series Device

Brand and Manufacturer

Xilinx

Features

Embedded FPGA (Field Programmable Gate Array)

192 LABs/CLBs

1728 Logic Elements/Cells

73728 Total RAM Bits

89 I/O pins

Product Performance

50K Gate Count for complex digital logic designs

Surface Mount Technology

Operating Temperature range 0°C to 85°C

Technical Specifications

Supply Voltage 1.14V to 1.26V

132-TFBGA, CSPBGA Package

Surface Mount Mounting Type

Dimensions, Shape, and Packaging

132-CSPBGA (8x8) Package

Ball Grid Array (BGA) packaging for small form factor

Quality and Reliability

Trusted brand in FPGA market

Industry standard for performance and durability

Product Advantages

Optimized for low cost

Wide operating temperature range

High I/O count for various connections

Product Competitiveness

Competitive in cost-sensitive applications

High gate density compared to other FPGAs in similar segment

Compatibility

Compatible with Spartan-3 FPGA development and programming tools

Standard Certification and Compliance

Compliance with industry standards for FPGAs

Lifespan and Sustainability

Despite being marked as Obsolete, still sustainable for legacy systems maintenance

Actual Application Fields

Industrial, automotive, consumer electronics, and communication devices where low-cost, high-density logic is required

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