XC3S400AN-4FTG256I
Part Number XC3S400AN-4FTG256I
Manufacturer AMD
Description IC FPGA 195 I/O 256FTBGA
Quantity Available 1009 pcs new original in stock.
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Technical Information of XC3S400AN-4FTG256I
Manufacturer Part Number XC3S400AN-4FTG256I Category Industrial Controls
Manufacturer AMD Description IC FPGA 195 I/O 256FTBGA
Package / Case 256-FTBGA (17x17) Quantity Available 1009 pcs
Voltage - Supply 1.14V ~ 1.26V Total RAM Bits 368640
Supplier Device Package 256-FTBGA (17x17) Series Spartan®-3AN
Package / Case 256-LBGA Package Tray
Operating Temperature -40°C ~ 100°C (TJ) Number of Logic Elements/Cells 8064
Number of LABs/CLBs 896 Number of I/O 195
Number of Gates 400000 Mounting Type Surface Mount
Base Product Number XC3S400  
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Product Model

XC3S400AN-4FTG256I

Introduction

The XC3S400AN-4FTG256I is an embedded FPGA (Field Programmable Gate Array) designed for various applications requiring customizable logic.

Brand and Manufacturer

Xilinx

Features

Embedded FPGA technology for flexible logic configurations.

Part of the Spartan®-3AN series known for reliability and performance.

Last Time Buy status indicates limited availability.

High number of LABs/CLBs (896) and Logic Elements/Cells (8064) for complex designs.

Ample Total RAM Bits (368640) for data storage and processing.

Large number of I/O (195) for versatile connectivity.

Extensive gates (400000) for implementing intricate logic functions.

Low voltage supply (1.14V ~ 1.26V) for power efficiency.

Surface mount mounting type for easy integration onto PCBs.

Wide operating temperature range (-40°C ~ 100°C) for various environmental conditions.

Compact 256-LBGA package for space-constrained applications.

Supplier Device Package: 256-FTBGA (17x17)

Product Performance

Offers high logic capacity and flexible configuration options.

Suitable for applications demanding extensive I/O and memory resources.

Operates reliably across a wide temperature range.

Maintains performance integrity under varying voltage conditions.

Technical Specifications

Base Product Number: XC3S400

Number of LABs/CLBs: 896

Number of Logic Elements/Cells: 8064

Total RAM Bits: 368640

Number of I/O: 195

Number of Gates: 400000

Voltage - Supply: 1.14V ~ 1.26V

Mounting Type: Surface Mount

Operating Temperature: -40°C ~ 100°C (TJ)

Package / Case: 256-LBGA

Supplier Device Package: 256-FTBGA (17x17)

Dimensions, Shape, and Packaging

Compact 256-FTBGA package measuring 17x17mm.

Packaged in trays for convenient handling and storage.

Quality and Reliability

Manufactured by Xilinx, known for high-quality semiconductor products.

Part of the Spartan®-3AN series renowned for reliability and robustness.

Product Advantages

Offers customizable logic suitable for various applications.

High logic capacity and extensive I/O for complex designs.

Low voltage supply for power-efficient operation.

Wide operating temperature range for versatility.

Product Competitiveness

Competes favorably with other embedded FPGA solutions in terms of performance and features.

Offers reliability and flexibility at a competitive price point.

Compatibility

Compatible with standard FPGA development tools and programming environments.

Standard Certification and Compliance

May comply with industry-standard certifications and regulations based on application requirements.

Lifespan and Sustainability

Last Time Buy status indicates limited availability, but lifespan may vary based on demand and production cycles.

Sustainability measures may vary based on the manufacturer's practices and policies.

Actual Application Fields

Suitable for a wide range of applications including industrial automation, telecommunications, aerospace, and automotive electronics.

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