XC3S400AN-4FTG256I | |
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Part Number | XC3S400AN-4FTG256I |
Manufacturer | AMD |
Description | IC FPGA 195 I/O 256FTBGA |
Quantity Available | 1009 pcs new original in stock. Request Stock & Quotation |
ECAD Model | |
Datasheets | 1.XC3S400AN-4FTG256I.pdf2.XC3S400AN-4FTG256I.pdf3.XC3S400AN-4FTG256I.pdf |
Download | XC3S400AN-4FTG256I Details PDF |
XC3S400AN-4FTG256I Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
Technical Information of XC3S400AN-4FTG256I | |||
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Manufacturer Part Number | XC3S400AN-4FTG256I | Category | Industrial Controls |
Manufacturer | AMD | Description | IC FPGA 195 I/O 256FTBGA |
Package / Case | 256-FTBGA (17x17) | Quantity Available | 1009 pcs |
Voltage - Supply | 1.14V ~ 1.26V | Total RAM Bits | 368640 |
Supplier Device Package | 256-FTBGA (17x17) | Series | Spartan®-3AN |
Package / Case | 256-LBGA | Package | Tray |
Operating Temperature | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells | 8064 |
Number of LABs/CLBs | 896 | Number of I/O | 195 |
Number of Gates | 400000 | Mounting Type | Surface Mount |
Base Product Number | XC3S400 | ||
Download | XC3S400AN-4FTG256I PDF - DE.pdf |
XC3S400AN-4FTG256I
The XC3S400AN-4FTG256I is an embedded FPGA (Field Programmable Gate Array) designed for various applications requiring customizable logic.
Xilinx
Embedded FPGA technology for flexible logic configurations.
Part of the Spartan®-3AN series known for reliability and performance.
Last Time Buy status indicates limited availability.
High number of LABs/CLBs (896) and Logic Elements/Cells (8064) for complex designs.
Ample Total RAM Bits (368640) for data storage and processing.
Large number of I/O (195) for versatile connectivity.
Extensive gates (400000) for implementing intricate logic functions.
Low voltage supply (1.14V ~ 1.26V) for power efficiency.
Surface mount mounting type for easy integration onto PCBs.
Wide operating temperature range (-40°C ~ 100°C) for various environmental conditions.
Compact 256-LBGA package for space-constrained applications.
Supplier Device Package: 256-FTBGA (17x17)
Offers high logic capacity and flexible configuration options.
Suitable for applications demanding extensive I/O and memory resources.
Operates reliably across a wide temperature range.
Maintains performance integrity under varying voltage conditions.
Base Product Number: XC3S400
Number of LABs/CLBs: 896
Number of Logic Elements/Cells: 8064
Total RAM Bits: 368640
Number of I/O: 195
Number of Gates: 400000
Voltage - Supply: 1.14V ~ 1.26V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)
Compact 256-FTBGA package measuring 17x17mm.
Packaged in trays for convenient handling and storage.
Manufactured by Xilinx, known for high-quality semiconductor products.
Part of the Spartan®-3AN series renowned for reliability and robustness.
Offers customizable logic suitable for various applications.
High logic capacity and extensive I/O for complex designs.
Low voltage supply for power-efficient operation.
Wide operating temperature range for versatility.
Competes favorably with other embedded FPGA solutions in terms of performance and features.
Offers reliability and flexibility at a competitive price point.
Compatible with standard FPGA development tools and programming environments.
May comply with industry-standard certifications and regulations based on application requirements.
Last Time Buy status indicates limited availability, but lifespan may vary based on demand and production cycles.
Sustainability measures may vary based on the manufacturer's practices and policies.
Suitable for a wide range of applications including industrial automation, telecommunications, aerospace, and automotive electronics.
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XC3S400AN-4FTG256I Datasheet | Download XC3S400AN-4FTG256I Datasheet | Manufacturer |
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