XC3S400AN-4FGG400C
Part Number XC3S400AN-4FGG400C
Manufacturer AMD
Description IC FPGA 311 I/O 400FBGA
Quantity Available 5100 pcs new original in stock.
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Datasheets 1.XC3S400AN-4FGG400C.pdf2.XC3S400AN-4FGG400C.pdf3.XC3S400AN-4FGG400C.pdf
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Technical Information of XC3S400AN-4FGG400C
Manufacturer Part Number XC3S400AN-4FGG400C Category Industrial Controls
Manufacturer AMD Description IC FPGA 311 I/O 400FBGA
Package / Case 400-FBGA (21x21) Quantity Available 5100 pcs
Voltage - Supply 1.14V ~ 1.26V Total RAM Bits 368640
Supplier Device Package 400-FBGA (21x21) Series Spartan®-3AN
Package / Case 400-BGA Package Tray
Operating Temperature 0°C ~ 85°C (TJ) Number of Logic Elements/Cells 8064
Number of LABs/CLBs 896 Number of I/O 311
Number of Gates 400000 Mounting Type Surface Mount
Base Product Number XC3S400  
DownloadXC3S400AN-4FGG400C PDF - DE.pdf

Product Model

XC3S400AN-4FGG400C

Introduction

Xilinx Spartan-3AN FPGA

Brand and Manufacturer

Xilinx

Features

Lead free / RoHS Compliant

Moisture Sensitivity Level 3 (168 Hours)

Embedded FPGA

Graphics Acceleration

Product Performance

Supply Voltage 1.14 V ~ 1.26 V

Number of I/O 896

Number of Gates 400000

Total RAM Bits 368640

Current - Supply 8064

Technical Specifications

Manufacturer Part Number XC3S400AN-4FGG400C

Supplier Device Package 400-FBGA (21x21)

Package / Case 400-BGA

Digi-Key Part Number 122-1554-ND

Other Names 122-1554

Dimensions, Shape, and Packaging

21x21 mm, 400-BGA packaging

Quality and Reliability

Lead free / RoHS Compliant

Moisture Sensitivity Level 3

Product Advantages

High I/O count

Large number of gates for complex designs

Embedded graphics acceleration

Product Competitiveness

Advanced features in Spartan series

Competitive for embedded applications

Compatibility

Surface Mount technology

Standard Certification and Compliance

Lead free / RoHS Compliant

Lifespan and Sustainability

Designed for longevity in embedded systems

Actual Application Fields

Suitable for high-performance, embedded processing

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