MAX3890ECB+D
Part Number MAX3890ECB+D
Manufacturer Analog Devices Inc./Maxim Integrated
Description IC SERIALIZER 2.5GBPS 67TQFN
Quantity Available 2538 pcs new original in stock.
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ECAD Model
Datasheets 1.MAX3890ECB+D.pdf2.MAX3890ECB+D.pdf3.MAX3890ECB+D.pdf4.MAX3890ECB+D.pdf5.MAX3890ECB+D.pdf
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Technical Information of MAX3890ECB+D
Manufacturer Part Number MAX3890ECB+D Category Integrated Circuits (ICs)
Manufacturer Analog Devices Inc./Maxim Integrated Description IC SERIALIZER 2.5GBPS 67TQFN
Package / Case 64-TQFP-EP (10x10) Quantity Available 2538 pcs
Voltage - Supply 3.3V Supplier Device Package 64-TQFP-EP (10x10)
Series - Package / Case 64-TQFP Exposed Pad
Package Tray Output Type PECL
Operating Temperature -40°C ~ 85°C Number of Outputs 1
Number of Inputs 16 Mounting Type Surface Mount
Input Type LVDS Function Serializer
Data Rate 2.5Gbps Base Product Number MAX389
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Product Model

MAX3890ECB+D

Introduction

High-Speed 16:1 Serializer for Data Transmission

Brand and Manufacturer

Analog Devices

Features

5Gbps Data Rate

LVDS Input

PECL Output

16 Inputs to 1 Output Configuration

Surface Mount Technology

Product Performance

Fast Serial Data Transmission

Reliable Operation at High Data Rates

Suitable for High-Frequency Applications

Technical Specifications

Function: Serializer

Voltage - Supply: 3.3V

Operating Temperature Range: -40°C to 85°C

Data Rate: 2.5Gbps

Dimensions, Shape, and Packaging

64-TQFP Exposed Pad

Supplier Device Package: 64-TQFP-EP (10x10)

Quality and Reliability

Built for High-Speed Communication

Robust Against Temperature Variations

Product Advantages

Compacts Data Streams into High-Speed Serial Link

Reduces Cable Bulk and Pin Count

Product Competitiveness

High Data Rate Capabilities

Supports Advanced Communication Systems

Compatibility

Compatible with LVDS Inputs and PECL Outputs

Standard Certification and Compliance

Meets Industry Standards for Serializers/Deserializers

Lifespan and Sustainability

Designed for Extended Use in Industrial Environments

Actual Application Fields

Telecommunications

Networking Equipment

Data Centers

High-Speed Computing Applications

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