XC5VLX330T-2FF1738I
Part Number XC5VLX330T-2FF1738I
Manufacturer XILINX
Description XILINX IC BGA-1738
Quantity Available 3600 pcs new original in stock.
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Datasheets XC5VLX330T-2FF1738I.pdf
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Technical Information of XC5VLX330T-2FF1738I
Manufacturer Part Number XC5VLX330T-2FF1738I Category Integrated Circuits (ICs)
Manufacturer XILINX Description XILINX IC BGA-1738
Package / Case BGA-1738 Quantity Available 3600 pcs
Condtion New Original Stock Warranty 100% Perfect Functions
Lead Time 2-3days after payment. Payment PayPal / Telegraphic Transfer / Western Union
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Product Model

XC5VLX330T-2FF1738I

Introduction

High-performance integrated circuit specializing in programmable logic solutions

Brand and Manufacturer

Xilinx

Features

High-density programmable logic

Advanced process technology

Powerful signal processing capabilities

High-speed serial connectivity

Product Performance

Optimized for high-complexity processing

Excellent heat dissipation

Stable operation at industrial temperature ranges

Technical Specifications

Programmable logic cell architecture

Supports various logic configurations

Integrated DSP slices

SRAM blocks for storage

Dimensions, Shape, and Packaging

Flip-chip package

1738-pin form factor

Standardized dimensions for compatibility with PCBs

Quality and Reliability

Rigorous testing for industrial applications

Long-term performance stability

Robust against environmental variations

Product Advantages

Flexible logic programming

Scalable to different application requirements

Efficient power consumption

Product Competitiveness

Positioned for cutting-edge industrial applications

Superior to competitors in programmable logic density

Broad community and ecosystem support

Compatibility

Compatible with standard FPGA development environments

Interoperable with a wide range of digital components

Standard Certification and Compliance

Meets industry-standard certifications

Complies with international safety and environmental regulations

Lifespan and Sustainability

Designed for extended lifecycle

Efficient design minimizing environmental impact over time

Actual Application Fields

Used in telecommunications

Ideal for data centers and server farms

Suitable for aerospace and defense applications

Adaptable for medical imaging technologies

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