XC5VLX330-1FF1760I
Part Number XC5VLX330-1FF1760I
Manufacturer AMD
Description IC FPGA 1200 I/O 1760FCBGA
Quantity Available 2852 pcs new original in stock.
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Datasheets 1.XC5VLX330-1FF1760I.pdf2.XC5VLX330-1FF1760I.pdf
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Technical Information of XC5VLX330-1FF1760I
Manufacturer Part Number XC5VLX330-1FF1760I Category Industrial Controls
Manufacturer AMD Description IC FPGA 1200 I/O 1760FCBGA
Package / Case 1760-FCBGA (42.5x42.5) Quantity Available 2852 pcs
Voltage - Supply 0.95V ~ 1.05V Total RAM Bits 10616832
Supplier Device Package 1760-FCBGA (42.5x42.5) Series Virtex®-5 LX
Package / Case 1760-BBGA, FCBGA Package Tray
Operating Temperature -40°C ~ 100°C (TJ) Number of Logic Elements/Cells 331776
Number of LABs/CLBs 25920 Number of I/O 1200
Mounting Type Surface Mount Base Product Number XC5VLX330
DownloadXC5VLX330-1FF1760I PDF - DE.pdf

Product Model

XC5VLX330-1FF1760I

Introduction

High-density, high-performance FPGA

Brand and Manufacturer

Xilinx

Features

Large number of LABs/CLBs and Logic Elements/Cells for complex designs

Extensive total RAM bits for memory-intensive applications

High number of I/O pins for versatile connectivity

Product Performance

Robust performance with a wide supply voltage range from 0.95V to 1.05V

Suited for extreme temperature environments, operating from -40°C to 100°C

Technical Specifications

FPGA from the Virtex®-5 LX series with advanced technology

Dimensions, Shape, and Packaging

Surface Mount, 1760-BBGA, FCBGA package

Packaged in a tray format, size 42.5mm x 42.5mm

Quality and Reliability

Designed to be reliable under various operating conditions

Product Advantages

Supports complex and high-speed signal processing

Product Competitiveness

Competitive in high-performance and high-density FPGA markets

Compatibility

Compatible with a wide range of electronic assemblies due to numerous I/O pins

Standard Certification and Compliance

Meets industry standards for electronic components

Lifespan and Sustainability

Designed for a long operational life under standard usage conditions

Actual Application Fields

Suitable for telecommunications, networking, aerospace, defense, and industrial applications

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