Product Model

GM8187ST-BD-C

Introduction

Integrated circuit specialized for advanced applications

Brand and Manufacturer

GRAIN

Features

High integration for complex processing tasks

Optimized for high-speed signal processing

Low power consumption

Product Performance

Robust processing capabilities

Enhanced data handling and storage efficiency

Reliable operation under extended temperatures

Technical Specifications

Package Type: BGA484

Main Category: Integrated Circuits (ICs)

Small Classification: Specialized ICs

Dimensions, Shape, and Packaging

Ball Grid Array (BGA) package

Dimensions specific to BGA484 standards

Secure and protective packaging for transit

Quality and Reliability

High-quality materials for improved lifespan

Strict manufacturing standards ensure reliability

Product Advantages

Advanced technology for superior performance

Cost-effective solution in specialized ICs market

Product Competitiveness

Competitive in markets requiring high-speed processing ICs

Superior performance metrics compared to industry standards

Compatibility

Compatible with multiple hardware architectures requiring BGA484 socket

Standard Certification and Compliance

Complies with industry standard certifications for electronic components

Lifespan and Sustainability

Designed for long-term use with minimal degradation

Eco-friendly components and manufacturing process

Actual Application Fields

Used in telecommunications, computing, and high-speed data processing industries

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