Product Model

GM8180SF-BD

Introduction

High-performance specialized integrated circuit for advanced computing applications

Brand and manufacturer

GRAIN

Features

Designed for high-speed processing

Supports complex algorithms and data-intensive tasks

Enhanced security features for robust data protection

Product performance

High computation speed

Efficient power management reduces thermal output

Reliable under extended operational conditions

Technical specifications

Package type: BGA (Ball Grid Array)

Specialized in high-frequency signal processing

Dimensions, shape, and packaging

Compact BGA package

Optimized for space-saving on circuit boards

Secure and protective packaging for safe transportation

Quality and reliability

Built to meet rigorous industry standards

Tested for durability and longevity in harsh environments

Product advantages

Superior processing power

Low power consumption

Highly secure against cyber threats

Product competitiveness

Stands out in the market for speed and efficiency

Competitively priced within its technology segment

Compatibility

Compatible with standard BGA sockets

Integrates seamlessly with GRAIN's other IC products

Standard certification and compliance

Complies with international standards for electronic components

Certified for environmental and safety regulations

Lifespan and sustainability

Designed for long operational life

Manufactured using eco-friendly practices

Actual application fields

Telecommunications

Data centers

Advanced computing systems

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