EP4CE22E22A7N
Part Number EP4CE22E22A7N
Manufacturer Intel
Description IC FPGA 79 I/O 144EQFP
Quantity Available 502 pcs new original in stock.
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Datasheets 1.EP4CE22E22A7N.pdf2.EP4CE22E22A7N.pdf3.EP4CE22E22A7N.pdf4.EP4CE22E22A7N.pdf5.EP4CE22E22A7N.pdf6.EP4CE22E22A7N.pdf7.EP4CE22E22A7N.pdf
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Technical Information of EP4CE22E22A7N
Manufacturer Part Number EP4CE22E22A7N Category Industrial Controls
Manufacturer Altera (Intel) Description IC FPGA 79 I/O 144EQFP
Package / Case 144-EQFP (20x20) Quantity Available 502 pcs
Voltage - Supply 1.15V ~ 1.25V Total RAM Bits 608256
Supplier Device Package 144-EQFP (20x20) Series Cyclone® IV E
Package / Case 144-LQFP Exposed Pad Package Tray
Operating Temperature -40°C ~ 125°C (TJ) Number of Logic Elements/Cells 22320
Number of LABs/CLBs 1395 Number of I/O 79
Mounting Type Surface Mount Base Product Number EP4CE22
DownloadEP4CE22E22A7N PDF - DE.pdf

Product Model

** EP4CE22E22A7N

**

Introduction

** EP4CE22E22A7N is an active member of the Cyclone® IV E series of embedded FPGAs (Field Programmable Gate Arrays), offering versatile programmable logic capabilities.

**

Brand and Manufacturer

** Manufactured by Intel.

**

Features

** This FPGA boasts a total of 1395 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks) and 22320 Logic Elements/Cells, enabling extensive customization for various applications. With 608256 RAM Bits, it provides ample memory resources. It offers 79 I/O (Input/Output) pins for interfacing with external devices.

**

Product Performance

** Operating within a voltage supply range of 1.15V to 1.25V, this FPGA is designed to withstand temperatures ranging from -40°C to 125°C, making it suitable for demanding environments.

**

Technical Specifications

** The EP4CE22E22A7N comes in a 144-LQFP Exposed Pad package with a 144-EQFP (20x20) supplier device package. It utilizes surface mount technology for easy installation.

**

Dimensions, Shape, and Packaging

** Packaged in a tray, the EP4CE22E22A7N FPGA features a compact and standardized 144-LQFP Exposed Pad form factor, ensuring compatibility with existing systems and designs.

**

Quality and Reliability

** Built by Intel, a leading semiconductor manufacturer, this FPGA undergoes rigorous quality assurance processes to ensure reliability and performance consistency.

**

Product Advantages

** The EP4CE22E22A7N offers high configurability, extensive I/O capabilities, and robust performance, making it suitable for a wide range of applications in industries such as telecommunications, automotive, aerospace, and more.

**

Product Competitiveness

** With its advanced features, ample resources, and reliable performance, the EP4CE22E22A7N competes favorably in the market against other embedded FPGAs.

**

Compatibility

with existing systems and designs.

**Quality and Reliability:** Built by Intel, a leading semiconductor manufacturer, this FPGA undergoes rigorous quality assurance processes to ensure reliability and performance consistency.

**Product Advantages:** The EP4CE22E22A7N offers high configurability, extensive I/O capabilities, and robust performance, making it suitable for a wide range of applications in industries such as telecommunications, automotive, aerospace, and more.

**Product Competitiveness:** With its advanced features, ample resources, and reliable performance, the EP4CE22E22A7N competes favorably in the market against other embedded FPGAs.

**Compatibility:** Designed to meet industry standards, this FPGA is compatible with various development tools, software libraries, and hardware interfaces, simplifying integration into existing systems and workflows.

**

Standard Certification and Compliance

** The EP4CE22E22A7N complies with industry-standard certifications and regulatory requirements, ensuring adherence to quality and safety standards.

**

Lifespan and Sustainability

** Built with durable materials and designed for long-term reliability, this FPGA offers a sustainable solution for ongoing and future projects.

**

Actual Application Fields

** This FPGA finds applications in diverse fields such as telecommunications infrastructure, industrial automation, medical devices, consumer electronics, and more, where customizable and high-performance logic processing is required.

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