W632GG6MB-11
Part Number W632GG6MB-11
Manufacturer Winbond Electronics
Description IC DRAM 2GBIT PAR 96VFBGA
Quantity Available 2976 pcs new original in stock.
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ECAD Model
Datasheets 1.W632GG6MB-11.pdf2.W632GG6MB-11.pdf3.W632GG6MB-11.pdf4.W632GG6MB-11.pdf
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Technical Information of W632GG6MB-11
Manufacturer Part Number W632GG6MB-11 Category Integrated Circuits (ICs)
Manufacturer Winbond Electronics Corporation Description IC DRAM 2GBIT PAR 96VFBGA
Package / Case 96-VFBGA (7.5x13) Quantity Available 2976 pcs
Write Cycle Time - Word, Page - Voltage - Supply 1.425V ~ 1.575V
Technology SDRAM - DDR3 Supplier Device Package 96-VFBGA (7.5x13)
Series - Package / Case 96-VFBGA
Package Tray Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount Memory Type Volatile
Memory Size 2Gbit Memory Organization 128M x 16
Memory Interface Parallel Memory Format DRAM
Clock Frequency 933 MHz Base Product Number W632GG6
Access Time 20 ns  
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Product Model

W632GG6MB-11

Introduction

DDR3 SDRAM Memory Module

Brand and Manufacturer

Winbond Electronics

Features

Volatile memory type

SDRAM - DDR3 technology

Parallel memory interface

Surface mount mounting type

Product Performance

Memory size of 2 Gbit

128M x 16 memory organization

Clock frequency of 933 MHz

Access time of 20 ns

Operating temperature range from 0°C to 95°C

Technical Specifications

Supply voltage between 1.425V and 1.575V

96-VFBGA package

Dimensions, Shape, and Packaging

96-VFBGA package dimension of 7.5x13 mm

Surface mount packaging

Quality and Reliability

Designed for a wide range of operating temperatures

Product Advantages

High clock speed

Low access time

Product Competitiveness

Competitive in high-speed computing applications

Compatibility

Compatible with devices requiring DDR3 SDRAM with parallel interface

Standard Certification and Compliance

Complies with standard DDR3 SDRAM requirements

Lifespan and Sustainability

Designed for sustained performance within the specified temperature range

Actual Application Fields

Used in computing applications requiring high-speed data processing

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