Product Model

S71WS128PCOHF3TR0

Introduction

Integrated circuit for specialized applications

Brand and Manufacturer

Souriau Connection Technology

Features

BGA (Ball Grid Array) package for robust mounting

Designed for specialized applications within electronics

Product Performance

Highly reliable under varied environmental conditions

Optimized for performance stability

Technical Specifications

Type: Specialized ICs

Package Type: BGA

Dimensions, Shape, and Packaging

Compact size suitable for dense circuit boards

Shipped in protective packaging to prevent damage

Quality and Reliability

Engineered to meet stringent industry standards

Proven durability and performance in field tests

Product Advantages

Superior signal integrity

Enhanced thermal management

Product Competitiveness

Stands out for reliability and efficiency in specialized IC markets

Compatibility

Compatible with standard BGA mounting and soldering processes

Standard Certification and Compliance

Meets global industry standards for electronics

Lifespan and Sustainability

Designed for long operational life

Eco-friendly materials and production process

Actual Application Fields

Used in advanced electronics systems requiring specialized ICs

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