Product Model

K4X51163PE-FGC6

Introduction

Specialized Integrated Circuit for advanced electronic applications

Brand and Manufacturer

Samsung Semiconductor

Features

High-speed operation

Low power consumption

Optimized for high-performance computing tasks

Product Performance

Enhanced data transfer rates

Stable performance under various conditions

Reliable operation in extreme environments

Technical Specifications

Type: BGA Package

Category: Specialized Integrated Circuits (ICs)

Dimensions, Shape, and Packaging

Compact BGA packaging for reduced space usage

Ergonomic design suitable for dense circuit board layouts

Quality and Reliability

Manufactured to high Samsung quality standards

Consistent performance assured through rigorous testing

Product Advantages

High integration capability facilitates complex system designs

Improved system efficiency due to high-speed functionality

Product Competitiveness

Competes favorably in markets requiring high-speed data processing

Widely recognized for reliability and innovation

Compatibility

Compatible with standard BGA socket configurations

Easily integrated into existing and new designs

Standard Certification and Compliance

Complies with international semiconductor standards

Certified for environmental and safety standards

Lifespan and Sustainability

Designed for long operational lifespan

Contributes to sustainable practices in electronics manufacturing

Actual Application Fields

Used in computing, mobile devices, and high-performance servers

Suitable for telecommunications and advanced electronics systems

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