Product Model

K4B2G0846D-HYK0

Introduction

High-performance memory chip designed for various digital applications.

Brand and Manufacturer

Samsung Semiconductor

Features

High data transfer rate

Low power consumption

Optimized for high-speed operations

Enhanced durability and heat dissipation

Product Performance

Robust thermal management

Stable performance under varying operational conditions

High reliability in continuous usage

Technical Specifications

Category: Integrated Circuits (ICs)

Classification: Specialized ICs

Package type: BGA78

Dimensions, Shape, and Packaging

Compact BGA (Ball Grid Array) packaging

Standardized dimensions for compatibility with various motherboard designs

Quality and Reliability

Rigorous quality control processes

Long-term reliability testing

Compliant with industry standards for quality assurance

Product Advantages

Enhanced processing power due to optimized design

High-speed data handling capabilities

Product Competitiveness

Competitive edge in memory technology

Preferred choice for leading technology manufacturers

Compatibility

Compatible with a wide range of digital devices and motherboards

Interoperable with other Samsung Semiconductor products

Standard Certification and Compliance

Meets global regulatory standards

Certified for environmental and safety compliance

Lifespan and Sustainability

Designed for extended lifespan with minimal degradation

Eco-friendly materials and manufacturing processes

Actual Application Fields

Used in computing systems

Applicable in mobile devices, servers, and high-performance computing environments

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