MPC8247ZQTMFA
Part Number MPC8247ZQTMFA
Manufacturer NXP USA Inc.
Description IC MPU MPC82XX 400MHZ 516BGA
Quantity Available 2523 pcs new original in stock.
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Datasheets 1.MPC8247ZQTMFA.pdf2.MPC8247ZQTMFA.pdf3.MPC8247ZQTMFA.pdf4.MPC8247ZQTMFA.pdf
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Technical Information of MPC8247ZQTMFA
Manufacturer Part Number MPC8247ZQTMFA Category Industrial Controls
Manufacturer Freescale / NXP Semiconductors Description IC MPU MPC82XX 400MHZ 516BGA
Package / Case 516-PBGA (27x27) Quantity Available 2523 pcs
Voltage - I/O 3.3V USB USB 2.0 (1)
Supplier Device Package 516-PBGA (27x27) Speed 400MHz
Series MPC82xx Security Features -
SATA - RAM Controllers DRAM, SDRAM
Package / Case 516-BBGA Package Tray
Operating Temperature 0°C ~ 105°C (TA) Number of Cores/Bus Width 1 Core, 32-Bit
Mounting Type Surface Mount Graphics Acceleration No
Ethernet 10/100Mbps (2) Display & Interface Controllers -
Core Processor PowerPC G2_LE Co-Processors/DSP Communications; RISC CPM
Base Product Number MPC82 Additional Interfaces I²C, SCC, SMC, SPI, UART, USART
DownloadMPC8247ZQTMFA PDF - DE.pdf

Product Model

MPC8247ZQTMFA

Introduction

High-performance microprocessor designed for embedded applications

Brand and manufacturer

NXP Semiconductors / Freescale

Features

Integrated PowerPC G2_LE core

Supports multiple communication protocols including IC, SCC, SMC, SPI, UART, USART

Includes co-processors for enhanced data processing capabilities

Support for DRAM and SDRAM memory controllers

Product performance

Operating speed of 400MHz

Single core, 32-bit bus architecture

Supports Ethernet speeds up to 100 Mbps

USB 2.0 interface capable

Technical specifications

516-BBGA package

3V I/O voltage

Operating Temperature range from 0°C to 105°C

Dimensions, shape, and packaging

Packaged in a 516-FPBGA (27x27)

Supplied in trays

Quality and reliability

Designed for high reliability and stability under extended operational temperatures

Product advantages

Robust processing power in a compact form factor

Flexible connectivity options for a range of applications

Product competitiveness

Competitive in applications requiring integrated communications capabilities

Compatibility

Compatible with a range of standard DRAM and SDRAM modules

Standard certification and compliance

Complies with industry standard specifications for embedded microprocessors

Lifespan and sustainability

Designed for long-term reliability in harsh environments

Actual application fields

Suitable for embedded systems in telecommunications, automotive, and industrial control systems

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