Technical Information of MCIMX6U5EVM10AB
Manufacturer Part Number MCIMX6U5EVM10AB Category Industrial Controls
Manufacturer Freescale / NXP Semiconductors Description IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Package / Case 624-MAPBGA (21x21) Quantity Available 3060 pcs
Voltage - I/O 1.8V, 2.5V, 2.8V, 3.3V USB USB 2.0 + PHY (4)
Supplier Device Package 624-MAPBGA (21x21) Speed 1.0GHz
Series i.MX6DL Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA - RAM Controllers LPDDR2, LVDDR3, DDR3
Package / Case 624-LFBGA Package Tray
Operating Temperature -20°C ~ 105°C (TJ) Number of Cores/Bus Width 2 Core, 32-Bit
Mounting Type Surface Mount Graphics Acceleration Yes
Ethernet 10/100/1000Mbps (1) Display & Interface Controllers Keypad, LCD
Core Processor ARM® Cortex®-A9 Co-Processors/DSP Multimedia; NEON™ SIMD
Base Product Number MCIMX6 Additional Interfaces CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART
DownloadMCIMX6U5EVM10AB PDF - DE.pdfMCIMX6U5EVM10AB PDF - FR.pdfMCIMX6U5EVM10AB PDF - ES.pdfMCIMX6U5EVM10AB PDF - IT.pdfMCIMX6U5EVM10AB PDF - KR.pdf

Product Model

MCIMX6U5EVM10AB

Introduction

NXP i.MX6DualLite series microprocessor for embedded applications

Brand and Manufacturer

NXP Semiconductors

Features

Dual-core ARM Cortex-A9 CPU

Multimedia processing with NEON SIMD extensions

Advanced graphics acceleration

Support for multiple memory interfaces

Product Performance

1.0GHz operating frequency

Robust graphics processing capabilities

High-speed Ethernet connectivity

Technical Specifications

ARM Cortex-A9 core at 1.0GHz

Multimedia co-processing

32-bit bus width

Dimensions, Shape, and Packaging

Packaged in a tray

624-LFBGA (MAPBGA) package format

Dimensions specified by 624-pin footprint (21x21mm)

Quality and Reliability

Built for demanding embedded applications

Operating temperature range from -20°C to 105°C

Product Advantages

Supports a variety of I/O and interface options

Enhanced graphics for rich multimedia experiences

Product Competitiveness

Competitive in fields requiring high-performance processing and multimedia capabilities

Compatibility

Interfaces with LPDDR2, LVDDR3, DDR3 memory

USB 2.0 + PHY support for peripheral connectivity

Standard Certification and Compliance

Meets industry standards for embedded microprocessors

Lifespan and Sustainability

Durable design suitable for long-term deployment

Actual Application Fields

Ideal for automotive systems, industrial controls, consumer electronics, and smart devices

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