A3PE1500-FG676
Part Number A3PE1500-FG676
Manufacturer Microchip Technology
Description IC FPGA 444 I/O 676FBGA
Quantity Available 2586 pcs new original in stock.
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ECAD Model
Datasheets 1.A3PE1500-FG676.pdf2.A3PE1500-FG676.pdf3.A3PE1500-FG676.pdf4.A3PE1500-FG676.pdf5.A3PE1500-FG676.pdf
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Technical Information of A3PE1500-FG676
Manufacturer Part Number A3PE1500-FG676 Category Industrial Controls
Manufacturer Microsemi Description IC FPGA 444 I/O 676FBGA
Package / Case 676-FBGA (27x27) Quantity Available 2586 pcs
Voltage - Supply 1.425V ~ 1.575V Total RAM Bits 276480
Supplier Device Package 676-FBGA (27x27) Series ProASIC3E
Package / Case 676-BGA Package Tray
Operating Temperature 0°C ~ 85°C (TJ) Number of I/O 444
Number of Gates 1500000 Mounting Type Surface Mount
Base Product Number A3PE1500  
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Product Model

A3PE1500-FG676

Introduction

This model is an FPGA from the ProASIC3E series designed for embedded applications.

Brand and Manufacturer

Microchip Technology

Features

High I/O count of 444 for versatile connectivity

Embedded memory with 276480 RAM bits for efficient data handling

Advanced encryption standard (AES) for secure programming

Product Performance

1.5 million gates for complex digital processing

Operates effectively within a voltage range of 1.425V to 1.575V

Functional across a temperature range of 0°C to 85°C

Technical Specifications

Voltage Supply: 1.425V ~ 1.575V

Total RAM Bits: 276480

Number of Gates: 1500000

Number of I/O: 444

Dimensions, Shape, and Packaging

676-BGA package

Dimensions in a 27x27 mm FBGA layout

Supplied in tray packaging for safe transportation

Quality and Reliability

Built to stringent quality standards for high reliability in embedded applications

Product Advantages

High integration capabilities with 1.5 million gates

Low power consumption with fine-grain power control

Product Competitiveness

Offers a competitive edge in embedded systems with its high gate count and rich feature set

Compatibility

Surface mount technology for compatibility with modern PCB manufacturing processes

Standard Certification and Compliance

Complies with common industry standards for electronic components

Lifespan and Sustainability

Designed for long-term deployment with durable materials and construction

Actual Application Fields

Widely used in telecommunications, automotive industries, and consumer electronics for complex digital processing tasks

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