PI3CH200LEX
Part Number PI3CH200LEX
Manufacturer Diodes Incorporated
Description IC BUS SWITCH 1 X 1:1 8TSSOP
Quantity Available 15456 pcs new original in stock.
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Datasheets 1.PI3CH200LEX.pdf2.PI3CH200LEX.pdf3.PI3CH200LEX.pdf4.PI3CH200LEX.pdf5.PI3CH200LEX.pdf6.PI3CH200LEX.pdf
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Technical Information of PI3CH200LEX
Manufacturer Part Number PI3CH200LEX Category Integrated Circuits (ICs)
Manufacturer Diodes Incorporated Description IC BUS SWITCH 1 X 1:1 8TSSOP
Package / Case 8-TSSOP Quantity Available 15456 pcs
Voltage Supply Source Single Supply Voltage - Supply 2.25V ~ 3.6V
Type Bus Switch Supplier Device Package 8-TSSOP
Series - Package / Case 8-TSSOP (0.173', 4.40mm Width)
Package Tape & Reel (TR) Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount Independent Circuits 2
Current - Output High, Low - Circuit 1 x 1:1
Base Product Number PI3CH200  
DownloadPI3CH200LEX PDF - DE.pdfPI3CH200LEX PDF - FR.pdfPI3CH200LEX PDF - ES.pdfPI3CH200LEX PDF - IT.pdfPI3CH200LEX PDF - KR.pdf

Product Model

PI3CH200LEX

Introduction

Logic Bus Switch developed by Diodes Incorporated

Brand and Manufacturer

Diodes Incorporated

Features

High-Speed Bus Switching

Multiple Independent Circuits

Compact 8-TSSOP Package

Product Performance

Designed for Routing Logic Signal Paths

Fast and low-resistance switching

Supports Hot-Swapping and Hot-Docking

Technical Specifications

1 x 1:1 Circuit Configuration

Surface Mount Technology

Single Supply Voltage Operation

Dimensions, Shape, and Packaging

8-TSSOP Package Dimensions 0.173", 4.40mm Width

Quality and Reliability

Optimized for High Durability and Performance Consistency

Product Advantages

Quick Signal Routing with Minimal Propagation Delay

Ideal for Applications Requiring Frequent Switching

Product Competitiveness

Obsolete Product with Possible Alternatives

Compatibility

Operates with a 2.25V to 3.6V Power Supply Range

Suitable for Hot-Swapping Applications

Standard Certification and Compliance

Manufactured in Compliance with Industry Standards (Specifics Needed)

Lifespan and Sustainability

Designed for Long-Term Operation Within Specified Temperature Range

Actual Application Fields

May be used in Telecom, Networking, and Data Communication Infrastructure Prior to Obsolescence

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