CY7C2670KV18-550BZI
Part Number CY7C2670KV18-550BZI
Manufacturer Infineon Technologies
Description IC SRAM 144MBIT PAR 165FBGA
Quantity Available 2659 pcs new original in stock.
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Datasheets 1.CY7C2670KV18-550BZI.pdf2.CY7C2670KV18-550BZI.pdf3.CY7C2670KV18-550BZI.pdf4.CY7C2670KV18-550BZI.pdf5.CY7C2670KV18-550BZI.pdf
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Technical Information of CY7C2670KV18-550BZI
Manufacturer Part Number CY7C2670KV18-550BZI Category Integrated Circuits (ICs)
Manufacturer Cypress Semiconductor Description IC SRAM 144MBIT PAR 165FBGA
Package / Case 165-FBGA (15x17) Quantity Available 2659 pcs
Write Cycle Time - Word, Page - Voltage - Supply 1.7V ~ 1.9V
Technology SRAM - Synchronous, DDR II+ Supplier Device Package 165-FBGA (15x17)
Series - Package / Case 165-LBGA
Package Tray Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount Memory Type Volatile
Memory Size 144Mbit Memory Organization 4M x 36
Memory Interface Parallel Memory Format SRAM
Clock Frequency 550 MHz Base Product Number CY7C2670
DownloadCY7C2670KV18-550BZI PDF - DE.pdf

Product Model

CY7C2670KV18-550BZI

Introduction

High-Speed Synchronous DDR II+ SRAM

Brand and Manufacturer

Infineon Technologies

Features

Volatile Memory

Synchronous DDR II+ SRAM Technology

High Clock Frequency Operation

Product Performance

Supports 550 MHz Clock Frequency

Parallel Memory Interface

Suited for High-Speed Data Buffering

Technical Specifications

Memory Size of 144Mbit

Memory Organization of 4M x 36

Dimensions, Shape, and Packaging

Packaged in a Tray

Surface Mount 165-LBGA

165-FBGA (15x17) Device Package

Quality and Reliability

Operates at Industrial Temperature Range of -40°C to 85°C

Robust against Harsh Conditions

Product Advantages

High-Speed Access

Large Memory Capacity

Product Competitiveness

Competitive in High-Performance Computing and Networking

Compatibility

Compatible with Systems Requiring High-Speed SRAM

Standard Certification and Compliance

Complies with Standard Industry Protocols and Specifications

Lifespan and Sustainability

Designed for Prolonged Lifecycle in Embedded Systems

Actual Application Fields

Networking

Telecommunication Infrastructure

High-Performance Computing Systems

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