MDM-9200-0-504CSP-TR-02 | |
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Part Number | MDM-9200-0-504CSP-TR-02 |
Manufacturer | N/A |
Description | MDM-9200-0-504CSP-TR-02 QUALCOMM |
Quantity Available | 2896 pcs new original in stock. Request Stock & Quotation |
ECAD Model | |
Datasheets | MDM-9200-0-504CSP-TR-02.pdf |
Download | MDM-9200-0-504CSP-TR-02 Details PDF |
MDM-9200-0-504CSP-TR-02 Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
Technical Information of MDM-9200-0-504CSP-TR-02 | |||
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Manufacturer Part Number | MDM-9200-0-504CSP-TR-02 | Category | Integrated Circuits (ICs) |
Manufacturer | N/A | Description | MDM-9200-0-504CSP-TR-02 QUALCOMM |
Package / Case | Quantity Available | 2896 pcs | |
Package | BGA | Condtion | New Original Stock |
Warranty | 100% Perfect Functions | Lead Time | 2-3days after payment. |
Payment | PayPal / Telegraphic Transfer / Western Union | Shipping by | DHL / Fedex / UPS |
Port | HongKong | RFQ Email | |
Download | MDM-9200-0-504CSP-TR-02 PDF - DE.pdf |
MDM-9200-0-504CSP-TR-02
High-performance modem chipset for mobile and networking applications
CSR PLC, a subsidiary of Qualcomm
Advanced processing capabilities for mobile data
High-speed connectivity support
Power-efficient design
Support for multiple communication standards
Enhanced security features
Robust data transmission rates
Low latency for real-time applications
Stable connectivity in various conditions
Reliable performance in multi-mode networks
Efficient power management for extended battery life
Part of the Integrated Circuits (ICs) category
Falls under Specialized ICs classification
Packaged as a Ball Grid Array (BGA)
Compact BGA format for space-saving on circuit boards
Sold in tape and reel packaging for automated assembly
Stringent quality control and testing
High manufacturing standards
Designed for durability and long-term operation
Optimized for next-gen network technologies
Seamless integration with Qualcomm's product ecosystem
Robust support and extensive documentation
Competitively positioned in the specialized ICs market
Benefits from Qualcomm's reputation and innovation
Compatible with leading mobile and networking platforms
Designed for interoperability with a range of devices
Meets relevant industry standards and certifications
Compliance with international regulatory requirements
Built for longevity in high-demand applications
Eco-friendly design and manufacturing processes
Mobile phones and smartphones
Networking equipment and infrastructure
Connected devices and IoT applications
MDM-9200-0-504CSP-TR-02 Stock | MDM-9200-0-504CSP-TR-02 Price | MDM-9200-0-504CSP-TR-02 Electronics | |||
MDM-9200-0-504CSP-TR-02 Components | MDM-9200-0-504CSP-TR-02 Inventory | MDM-9200-0-504CSP-TR-02 Digikey | |||
Supplier MDM-9200-0-504CSP-TR-02 | Order MDM-9200-0-504CSP-TR-02 Online | Inquiry MDM-9200-0-504CSP-TR-02 | |||
MDM-9200-0-504CSP-TR-02 Image | MDM-9200-0-504CSP-TR-02 Picture | MDM-9200-0-504CSP-TR-02 PDF | |||
MDM-9200-0-504CSP-TR-02 Datasheet | Download MDM-9200-0-504CSP-TR-02 Datasheet | Manufacturer Qualcomm |
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