CU10Y13R3BAT2A
Part Number CU10Y13R3BAT2A
Manufacturer KYOCERA AVX
Description CAP CER 3.3PF 16V C0G/NP0 01005
Quantity Available 2527 pcs new original in stock.
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Datasheets 1.CU10Y13R3BAT2A.pdf2.CU10Y13R3BAT2A.pdf
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Technical Information of CU10Y13R3BAT2A
Manufacturer Part Number CU10Y13R3BAT2A Category  
Manufacturer AVX (KYOCERA AVX) Description CAP CER 3.3PF 16V C0G/NP0 01005
Package / Case 01005 (0402 Metric) Quantity Available 2527 pcs
Voltage - Rated 16V Tolerance ±0.1pF
Thickness (Max) 0.009" (0.22mm) Temperature Coefficient C0G, NP0
Size / Dimension 0.016" L x 0.008" W (0.40mm x 0.20mm) Series CU
Ratings - Package / Case 01005 (0402 Metric)
Package Tape & Reel (TR) Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount, MLCC Lead Style -
Lead Spacing - Height - Seated (Max) -
Features Ultra Low ESR Capacitance 3.3 pF
Applications RF, Microwave, High Frequency  
DownloadCU10Y13R3BAT2A PDF - DE.pdfCU10Y13R3BAT2A PDF - FR.pdfCU10Y13R3BAT2A PDF - ES.pdfCU10Y13R3BAT2A PDF - IT.pdfCU10Y13R3BAT2A PDF - KR.pdf

Product Model

CU10Y13R3BAT2A

Introduction

Ceramic capacitor for high-frequency applications

Brand and manufacturer

AVX

Features

Ultra Low ESR

High stability and reliability

Suitable for RF and microwave applications

Product performance

Capacitance of 3.3 pF

Tolerance of ±0.1 pF

Voltage rated at 16V

Operates within temperature range of -55°C to 125°C

Technical specifications

Capacitance: 3.3 pF

Tolerance: ±0.1 pF

Voltage - Rated: 16V

Temperature Coefficient: C0G, NP0

Dimensions, shape, and packaging

Dimensions: 0.016" L x 0.008" W (0.40mm x 0.20mm)

Thickness: 0.009" (0.22mm)

Packaging: Tape & Reel (TR)

Surface Mount, MLCC (Multilayer Ceramic Chip Capacitor)

Quality and reliability

High temperature and voltage stability

Robust construction for reliability in critical applications

Product advantages

Designed for high frequency applications

Compact size for space-sensitive designs

Product competitiveness

Competitive in markets requiring high precision and stability

Ideal for RF and microwave technology

Compatibility

Compatible with surface mount technologies for electronic assemblies

Standard certification and compliance

Complies with industry standards for electronic components

Lifespan and sustainability

Designed to perform reliably over a wide range of environmental conditions

Actual application fields

Used in RF and microwave systems, including telecommunications and radar systems

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