Technical Information of EPF6010ATC100-3N
Manufacturer Part Number EPF6010ATC100-3N Category Industrial Controls
Manufacturer Altera (Intel) Description IC FPGA 71 I/O 100TQFP
Package / Case 100-TQFP (14x14) Quantity Available 2965 pcs
Voltage - Supply 3V ~ 3.6V Supplier Device Package 100-TQFP (14x14)
Series FLEX 6000 Package / Case 100-TQFP
Package Tray Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 880 Number of LABs/CLBs 88
Number of I/O 71 Number of Gates 10000
Mounting Type Surface Mount Base Product Number EPF6010
DownloadEPF6010ATC100-3N PDF - DE.pdf

Product Model

EPF6010ATC100-3N

Introduction

Intel FPGA part of the FLEX 6000 Series

Brand and Manufacturer

Intel

Features

Embedded FPGA technology

Field Programmable Gate Array configuration

88 Logic Array Blocks (LABs)

880 Logic Elements/Cells

71 Input/Output pins

10,000 Logic Gates capacity

Product Performance

Support for supply voltages from 3V to 3.6V

Surface Mount technology for PCB integration

Applicable for high-performance logic solutions

Technical Specifications

100-TQFP package

Surface-mountable form factor

Obsolete product status

Dimensions, Shape, and Packaging

Package/Case: 100-TQFP

Dimensions: 14x14 mm package footprint

Packaging not specified (obsolete product)

Quality and Reliability

Manufactured by Intel, an industry leader in semiconductor reliability

Product Advantages

Compatibility with various data and control plane applications

Product Competitiveness

High logic gate density for complex functions

Compatibility

with various data and control plane applications

Product Competitiveness

High logic gate density for complex functions

Compatibility

Interface compatibility with a broad range of signal standards

Standard Certification and Compliance

Complies with standard FPGA application requirements

Lifespan and Sustainability

Limited lifespan due to obsolete status

Considerations for sustainability in the design and end-of-life processes

Actual Application Fields

Used in a variety of embedded system applications

Applicable in communication devices, automotive systems, and consumer electronics

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