5CSXFC4C6U23C7N
Part Number 5CSXFC4C6U23C7N
Manufacturer Intel
Description IC SOC CORTEX-A9 800MHZ 672UBGA
Quantity Available 2645 pcs new original in stock.
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Datasheets 1.5CSXFC4C6U23C7N.pdf2.5CSXFC4C6U23C7N.pdf3.5CSXFC4C6U23C7N.pdf4.5CSXFC4C6U23C7N.pdf5.5CSXFC4C6U23C7N.pdf6.5CSXFC4C6U23C7N.pdf7.5CSXFC4C6U23C7N.pdf
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Technical Information of 5CSXFC4C6U23C7N
Manufacturer Part Number 5CSXFC4C6U23C7N Category Industrial Controls
Manufacturer Altera (Intel) Description IC SOC CORTEX-A9 800MHZ 672UBGA
Package / Case 672-UBGA (23x23) Quantity Available 2645 pcs
Supplier Device Package 672-UBGA (23x23) Speed 800MHz
Series Cyclone® V SX RAM Size 64KB
Primary Attributes FPGA - 40K Logic Elements Peripherals DMA, POR, WDT
Package / Case 672-FBGA Package Tray
Operating Temperature 0°C ~ 85°C (TJ) Number of I/O MCU - 181, FPGA - 145
Flash Size - Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Architecture MCU, FPGA
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Product Model

5CSXFC4C6U23C7N

Introduction

Intel Cyclone® V SX SoC with Dual ARM® Cortex®-A9

Brand and Manufacturer

Intel

Features

Embedded System On Chip (SoC)

MCU, FPGA Architecture

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripheral Support (DMA, POR, WDT)

Product Performance

Core Processor Speed: 800MHz

RAM Size: 64KB

High Integration for Lower Power Consumption

Technical Specifications

FPGA - 40K Logic Elements

Primary Attributes: SoC with integrated MCU and FPGA

Dimensions, Shape, and Packaging

Package: 672-FBGA

Tray Packaging

Supplier Device Package: 672-UBGA (23x23)

Quality and Reliability

Active Product Status

Proven Intel Quality and Reliability

Product Advantages

High System Integration

Lower System Cost and Power

Product Competitiveness

High Performance-to-Power Ratio in the Cyclone® Series

Compatibility

Broad Range of I/O Compatibility

Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Standard Certification and Compliance

Industry Standard Compliance

Lifespan and Sustainability

Long Lifespan for Embedded Applications

Robust for Various Temperature Ranges (0°C ~ 85°C)

Actual Application Fields

Embedded Computing

Industrial

Automotive

Communication Infrastructure

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