10M25DAF256I7G
Part Number 10M25DAF256I7G
Manufacturer Intel
Description IC FPGA 178 I/O 256FBGA
Quantity Available 549 pcs new original in stock.
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Datasheets 1.10M25DAF256I7G.pdf2.10M25DAF256I7G.pdf3.10M25DAF256I7G.pdf4.10M25DAF256I7G.pdf5.10M25DAF256I7G.pdf6.10M25DAF256I7G.pdf7.10M25DAF256I7G.pdf
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Technical Information of 10M25DAF256I7G
Manufacturer Part Number 10M25DAF256I7G Category Industrial Controls
Manufacturer Altera (Intel) Description IC FPGA 178 I/O 256FBGA
Package / Case 256-FBGA (17x17) Quantity Available 549 pcs
Voltage - Supply 1.15V ~ 1.25V Total RAM Bits 691200
Supplier Device Package 256-FBGA (17x17) Series MAX® 10
Package / Case 256-LBGA Package Tray
Operating Temperature -40°C ~ 100°C (TJ) Number of Logic Elements/Cells 25000
Number of LABs/CLBs 1563 Number of I/O 178
Mounting Type Surface Mount  
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Product Model

10M25DAF256I7G

Introduction

Embedded FPGA (Field Programmable Gate Array) model 10M25DAF256I7G by Intel.

Brand and Manufacturer

Brand: Intel

Manufacturer: Intel

Features

Active product status with 1563 LABs/CLBs.

Offers 25000 logic elements/cells and 691200 total RAM bits.

Provides 178 I/O options for versatile connectivity.

Operates within a voltage supply range of 1.15V to 1.25V.

Surface mount mounting type suitable for various applications.

Wide operating temperature range from -40°C to 100°C (TJ).

Packaged in a 256-LBGA case with a 256-FBGA (17x17) supplier device package.

Product Performance

High-performance embedded FPGA suitable for various applications.

Efficient utilization of logic elements and RAM bits for optimized performance.

Reliable performance across a wide temperature range.

Technical Specifications

Number of LABs/CLBs: 1563

Number of Logic Elements/Cells: 25000

Total RAM Bits: 691200

Number of I/O: 178

Voltage Supply: 1.15V ~ 1.25V

Mounting Type: Surface Mount

Operating Temperature: -40°C ~ 100°C (TJ)

Package / Case: 256-LBGA

Supplier Device Package: 256-FBGA (17x17)

Dimensions, Shape, and Packaging

Package/Case: 256-LBGA

Supplier Device Package: 256-FBGA (17x17)

Quality and Reliability

Manufactured by Intel, ensuring high quality and reliability.

Suitable for demanding applications requiring consistent performance.

Product Advantages

Versatile I/O options for flexible connectivity.

Wide operating temperature range enables usage in various environments.

Product Competitiveness

Competitive performance and features compared to other embedded FPGAs in the market.

Compatibility

Designed for compatibility with various systems and applications.

Standard Certification and Compliance

Complies with industry standards for embedded FPGA devices.

Lifespan and Sustainability

Designed for long-term use with reliable performance.

Manufactured with consideration for sustainability and environmental impact.

Actual Application Fields

Embedded systems requiring FPGA capabilities.

Industrial automation, telecommunications, aerospace, and more.

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