XCZU9EG-1FFVB1156I
Part Number XCZU9EG-1FFVB1156I
Manufacturer AMD
Description IC SOC CORTEX-A53 1156FCBGA
Quantity Available 2838 pcs new original in stock.
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Datasheets 1.XCZU9EG-1FFVB1156I.pdf2.XCZU9EG-1FFVB1156I.pdf
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Technical Information of XCZU9EG-1FFVB1156I
Manufacturer Part Number XCZU9EG-1FFVB1156I Category Industrial Controls
Manufacturer AMD Description IC SOC CORTEX-A53 1156FCBGA
Package / Case 1156-FCBGA (35x35) Quantity Available 2838 pcs
Supplier Device Package 1156-FCBGA (35x35) Speed 500MHz, 600MHz, 1.2GHz
Series Zynq® UltraScale+™ MPSoC EG RAM Size 256KB
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Peripherals DMA, WDT
Package / Case 1156-BBGA, FCBGA Package Tray
Operating Temperature -40°C ~ 100°C (TJ) Number of I/O 328
Flash Size - Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Base Product Number XCZU9
Architecture MCU, FPGA  
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Product Model

XCZU9EG-1FFVB1156I

Introduction

Zynq UltraScale+ MPSoC EG series by Xilinx

Brand and Manufacturer

Xilinx

Features

Combines FPGA and ARM Cortex-A53 processor

599K+ Logic Cells

Supports various connectivity options such as CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG

Features DMA and WDT peripherals

Product Performance

Operating speeds ranging from 500MHz to 1.2GHz

Temperature range: -40°C to 100°C

256KB RAM Size

Technical Specifications

Architecture: MCU, FPGA

Package/Case: 1156-BBGA, FCBGA

Supplier Device Package: 1156-FCBGA (35x35)

Number of I/O: 328

Dimensions, Shape, and Packaging

Packaging: Tray

Package Dimensions: 35x35 mm

Quality and Reliability

Active product status

Reliable performance under specified operating conditions

Product Advantages

Integration of FPGA and MCU functionality

High logic cell count for versatile applications

Wide range of connectivity options

Product Competitiveness

Offers a balance between processing power and flexibility

Suitable for various embedded system applications

Compatibility

Designed for embedded system applications requiring FPGA and MCU capabilities

Standard Certification and Compliance

Compliant with relevant industry standards

Lifespan and Sustainability

Active product status indicates continued availability and support

Designed for long-term use in industrial and embedded applications

Actual Application Fields

Embedded systems requiring high-performance processing and FPGA flexibility

Industrial automation, automotive, aerospace, telecommunications, and more

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