| XC7Z100-1FFG900C | |
|---|---|
| Part Number | XC7Z100-1FFG900C |
| Manufacturer | XILINX |
| Description | XILINX IC BGA-900 |
| Quantity Available | 3908 pcs new original in stock. Request Stock & Quotation |
| ECAD Model | |
| Datasheets | XC7Z100-1FFG900C.pdf |
| XC7Z100-1FFG900C Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
| Technical Information of XC7Z100-1FFG900C | |||
|---|---|---|---|
| Manufacturer Part Number | XC7Z100-1FFG900C | Category | Integrated Circuits (ICs) |
| Manufacturer | XILINX | Description | XILINX IC BGA-900 |
| Package / Case | BGA-900 | Quantity Available | 3908 pcs |
| Condtion | New Original Stock | Warranty | 100% Perfect Functions |
| Lead Time | 2-3days after payment. | Payment | PayPal / Telegraphic Transfer / Western Union |
| Shipping by | DHL / Fedex / UPS | Port | HongKong |
| RFQ Email |
Product Model
XC7Z100-1FFG900C
Introduction
Xilinx XC7Z100-1FFG900C is a high-performance system-on-chip (SoC) from the Zynq-7000 family, integrating an ARM Cortex-A9 processor with FPGA logic.
Brand and Manufacturer
Xilinx
Features
Integrated dual-core ARM Cortex-A9
28nm process for optimized power efficiency
Extensive DSP and logic resources
High-bandwidth peripheral interconnect
Advanced memory interfacing capabilities
Product Performance
Support for high-speed DDR3 and DDR3L SDRAM
High-throughput memory performance
Optimized for processing-intensive applications
Technical Specifications
Dual ARM Cortex-A9 MPCore up to 800 MHz
Artix-7 class FPGA fabric
6M logic cells
5 Gb/s transceivers
PCIe Gen2 block
Dimensions, Shape, and Packaging
900-pin flip-chip fine pitch BGA (FFG) package
Package dimensions: 31x31 mm
Packaging: Tray or tape and reel
Quality and Reliability
High MTBF and lower failure rates
Stringent quality testing and validation
Industrial temperature range support
Product Advantages
Flexible programmable logic integration
Optimized power consumption
Zynq-7000 ecosystem and software support
Product Competitiveness
Combines processor and FPGA for reduced system complexity
Competitive performance to power ratio
Broad adaptation in various markets
Compatibility
Support for industry-standard embedded operating systems
Compatible with multiple development environments and tools
Conforms to multi-gigabit interconnect standards
Standard Certification and Compliance
RoHS compliant
Lead-free package
Meets IPC/JEDEC J-STD-020 standards
Lifespan and Sustainability
Long life cycle with guaranteed availability
Eco-friendly with lead-free manufacturing
Actual Application Fields
Embedded systems
Industrial control and automation
Communications infrastructure
Automotive driver assistance systems
Aerospace and defense applications
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