Product Model

XC6VSX315T-1FFG1156C

Introduction

High-capacity, high-performance FPGA chip designed for demanding applications

Brand and Manufacturer

Xilinx

Features

High logic gate density

Advanced DSP slices

High-speed serial connectivity with GTP transceivers

Multiple clock management tiles

Enhanced memory logic resources

Support for high-bandwidth memory interfaces

Product Performance

Robust system logic cell performance

Superior signal processing capabilities

Optimized for high-speed data processing and transmission

Low power consumption with various power-saving features

Technical Specifications

FPGA logic cells

DSP Slices

Block RAM

Clock management tiles

High-speed GTP transceivers

Configurable logic blocks

Dimensions, Shape, and Packaging

1156-pin flip-chip fine-pitch ball grid array (FFGBA) package

Square-shaped integrated circuit

Standardized IC dimensions for compatibility with PCB design

Quality and Reliability

Stringent manufacturing quality control

High Mean Time Between Failures (MTBF)

Resistant to radiation effects and electrostatic discharge

Product Advantages

Scalable performance

Integration of multiple functions into a single device

Reduced system complexity and board space utilization

Product Competitiveness

Competitive pricing in the FPGA market

Strong support and development ecosystem

Extensive documentation and user community

Compatibility

Compatible with standard FPGA development tools and software

Supports a wide range of industry-standard interfaces and protocols

Standard Certification and Compliance

Compliant with RoHS and other environmental directives

Meets industry-standard certifications for electronic components

Lifespan and Sustainability

Long operational lifespan due to robust design

Options for extended lifecycle support through Xilinx programs

Actual Application Fields

Telecommunications infrastructure

Data center computing

High-performance embedded systems

Military and aerospace systems

Medical imaging equipment

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