XC6SLX150T-3FG676C
Part Number XC6SLX150T-3FG676C
Manufacturer AMD
Description IC FPGA 396 I/O 676FCBGA
Quantity Available 3071 pcs new original in stock.
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Datasheets XC6SLX150T-3FG676C.pdf
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Technical Information of XC6SLX150T-3FG676C
Manufacturer Part Number XC6SLX150T-3FG676C Category Industrial Controls
Manufacturer AMD Description IC FPGA 396 I/O 676FCBGA
Package / Case 676-FBGA (27x27) Quantity Available 3071 pcs
Voltage - Supply 1.14V ~ 1.26V Total RAM Bits 4939776
Supplier Device Package 676-FBGA (27x27) Series Spartan®-6 LXT
Package / Case 676-BGA Package Tray
Operating Temperature 0°C ~ 85°C (TJ) Number of Logic Elements/Cells 147443
Number of LABs/CLBs 11519 Number of I/O 396
Mounting Type Surface Mount Base Product Number XC6SLX150
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Product Model

XC6SLX150T-3FG676C

Introduction

This product is from the Spartan-6 LXT series and is categorized as an Integrated Circuit, specifically an Embedded Field Programmable Gate Array (FGPA).

Brand and Manufacturer

The brand and manufacturer is Xilinx.

Features

This Spartan-6 LXT chip boasts a voltage supply of between 1.14 V and 1.26 V. It has a total RAM bit of 4939776. The FPGA chip is capable of operating at a temperature range of 0˚C to 85˚C.

Product Performance

The FPGA chip comes with a 396 number of I/O and a considerable 11,519 number of LABs/CLBs. It also houses a total of 147,443 logic elements/cells.

Technical Specifications

The product has a small classification of an embedded FGPA. Its FGPA has a moisture sensitivity level of 4 (72 hours).

Dimensions, Shape, and Packaging

The FPGA chip features a 676-BBGA, FCBGA type of packaging design. Its supplier device package includes a 676-FCBGA (27 x 27). It's designed to be mounted on a surface.

Quality and Reliability

Despite containing lead, the product is constructed with industry-standard materials that offer consistent performance. The Spartan-6 LXT chip is designed to sustain intensive operating conditions.

Product Advantages

With an integrated large number of logic elements/cells, it provides an efficient solution for complex computing tasks.

Product Competitiveness

The FPGA boasts an extensive operating temperature range and high moisture sensitivity level, further bolstering its competitiveness in the market.

Compatibility

The FGPA chip's compatibility information is currently unavailable.

Standard Certification and Compliance

Its compliance with RoHS is not confirmed as it contains lead.

Lifespan and Sustainability

The manufacturer standard lead time is 10 weeks, suggesting its overall longevity and sustainability.

Actual Application Fields

Given its technical specifications, the FPGA chip can be utilized in various compute-intensive application fields. It's primarily used in the field of integrated circuits.

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