XC6SLX150T-3FG676C | |
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Part Number | XC6SLX150T-3FG676C |
Manufacturer | AMD |
Description | IC FPGA 396 I/O 676FCBGA |
Quantity Available | 3071 pcs new original in stock. Request Stock & Quotation |
ECAD Model | |
Datasheets | XC6SLX150T-3FG676C.pdf |
Download | XC6SLX150T-3FG676C Details PDF |
XC6SLX150T-3FG676C Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
Technical Information of XC6SLX150T-3FG676C | |||
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Manufacturer Part Number | XC6SLX150T-3FG676C | Category | Industrial Controls |
Manufacturer | AMD | Description | IC FPGA 396 I/O 676FCBGA |
Package / Case | 676-FBGA (27x27) | Quantity Available | 3071 pcs |
Voltage - Supply | 1.14V ~ 1.26V | Total RAM Bits | 4939776 |
Supplier Device Package | 676-FBGA (27x27) | Series | Spartan®-6 LXT |
Package / Case | 676-BGA | Package | Tray |
Operating Temperature | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells | 147443 |
Number of LABs/CLBs | 11519 | Number of I/O | 396 |
Mounting Type | Surface Mount | Base Product Number | XC6SLX150 |
Download | XC6SLX150T-3FG676C PDF - DE.pdf |
XC6SLX150T-3FG676C
This product is from the Spartan-6 LXT series and is categorized as an Integrated Circuit, specifically an Embedded Field Programmable Gate Array (FGPA).
The brand and manufacturer is Xilinx.
This Spartan-6 LXT chip boasts a voltage supply of between 1.14 V and 1.26 V. It has a total RAM bit of 4939776. The FPGA chip is capable of operating at a temperature range of 0˚C to 85˚C.
The FPGA chip comes with a 396 number of I/O and a considerable 11,519 number of LABs/CLBs. It also houses a total of 147,443 logic elements/cells.
The product has a small classification of an embedded FGPA. Its FGPA has a moisture sensitivity level of 4 (72 hours).
The FPGA chip features a 676-BBGA, FCBGA type of packaging design. Its supplier device package includes a 676-FCBGA (27 x 27). It's designed to be mounted on a surface.
Despite containing lead, the product is constructed with industry-standard materials that offer consistent performance. The Spartan-6 LXT chip is designed to sustain intensive operating conditions.
With an integrated large number of logic elements/cells, it provides an efficient solution for complex computing tasks.
The FPGA boasts an extensive operating temperature range and high moisture sensitivity level, further bolstering its competitiveness in the market.
The FGPA chip's compatibility information is currently unavailable.
Its compliance with RoHS is not confirmed as it contains lead.
The manufacturer standard lead time is 10 weeks, suggesting its overall longevity and sustainability.
Given its technical specifications, the FPGA chip can be utilized in various compute-intensive application fields. It's primarily used in the field of integrated circuits.
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XC6SLX150T-3FG676C Datasheet | Download XC6SLX150T-3FG676C Datasheet | Manufacturer |
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XC6SLX150T-3FGG676 | XILINX | |||
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XC6SLX150T-3FGG676C | IC FPGA 396 I/O 676FBGA | AMD |
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