XC4VSX25-11FFG668I
Part Number XC4VSX25-11FFG668I
Manufacturer Xilinx
Description IC FPGA 320 I/O 668FCBGA
Quantity Available 3063 pcs new original in stock.
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Datasheets XC4VSX25-11FFG668I.pdf
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Technical Information of XC4VSX25-11FFG668I
Manufacturer Part Number XC4VSX25-11FFG668I Category Industrial Controls
Manufacturer Xilinx Description IC FPGA 320 I/O 668FCBGA
Package / Case 668-FCBGA (27x27) Quantity Available 3063 pcs
Voltage - Supply 1.14 V ~ 1.26 V Total RAM Bits 2359296
Supplier Device Package 668-FCBGA (27x27) Series Virtex®-4 SX
Package / Case 668-BBGA, FCBGA Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 23040 Number of LABs/CLBs 2560
Number of I/O 320 Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 4 (72 Hours) Manufacturer Standard Lead Time 10 Weeks
Lead Free Status / RoHS Status Lead free / RoHS Compliant Base Part Number XC4VSX25
DownloadXC4VSX25-11FFG668I PDF - DE.pdf

Product Model

XC4VSX25-11FFG668I

Introduction

The XC4VSX25-11FFG668I is a high-performance FPGA (Field Programmable Gate Array) designed for embedded applications, offering versatility and flexibility in system design.

Brand and Manufacturer

Brand: Xilinx

Manufacturer: Xilinx

Features

Embedded FPGA suitable for a wide range of applications

High-density integration with a large number of logic elements

Low voltage supply for energy efficiency

Lead-free and RoHS compliant for environmental sustainability

Product Performance

Operating temperature range from -40°C to 100°C ensures reliability in various environments

Large number of I/Os (320) for versatile connectivity options

Extensive RAM bits (2359296) for data storage and processing

Technical Specifications

Voltage Supply: 1.14 V ~ 1.26 V

Package / Case: 668-BBGA, FCBGA

Supplier Device Package: 668-FCBGA (27x27)

Mounting Type: Surface Mount

Number of LABs/CLBs: 2560

Number of Logic Elements/Cells: 23040

Total RAM Bits: 2359296

Moisture Sensitivity Level (MSL): 4 (72 Hours)

Manufacturer Standard Lead Time: 10 Weeks

Dimensions, Shape, and Packaging

Package Size: 668-BBGA (27x27)

Surface mountable for easy integration into circuit boards

Quality and Reliability

Lead-free and RoHS compliant for environmental safety

Designed and manufactured by Xilinx, a trusted leader in FPGA technology

Product Advantages

Versatile and flexible for a wide range of applications

High performance and reliability in various operating conditions

Product Competitiveness

Competitive features and specifications compared to other FPGAs in its class

Compatibility

Compatible with standard FPGA development tools and software

Standard Certification and Compliance

Lead-free and RoHS compliant

Lifespan and Sustainability

Designed for long-term reliability and environmental sustainability

Actual Application Fields

Embedded systems, telecommunications, automotive, aerospace, industrial automation, and more.

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