XC2S100-6PQ208C
Part Number XC2S100-6PQ208C
Manufacturer AMD
Description IC FPGA 140 I/O 208QFP
Quantity Available 2860 pcs new original in stock.
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Datasheets 1.XC2S100-6PQ208C.pdf2.XC2S100-6PQ208C.pdf3.XC2S100-6PQ208C.pdf
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Technical Information of XC2S100-6PQ208C
Manufacturer Part Number XC2S100-6PQ208C Category Industrial Controls
Manufacturer AMD Description IC FPGA 140 I/O 208QFP
Package / Case 208-PQFP (28x28) Quantity Available 2860 pcs
Voltage - Supply 2.375V ~ 2.625V Total RAM Bits 40960
Supplier Device Package 208-PQFP (28x28) Series Spartan®-II
Package / Case 208-BFQFP Package Tray
Operating Temperature 0°C ~ 85°C (TJ) Number of Logic Elements/Cells 2700
Number of LABs/CLBs 600 Number of I/O 140
Number of Gates 100000 Mounting Type Surface Mount
Base Product Number XC2S100  
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Product Model

XC2S100-6PQ208C

Introduction

The XC2S100-6PQ208C is a Spartan-II series FPGA developed by Xilinx for high-performance digital circuits integration.

Brand and Manufacturer

Xilinx

Features

600 logic blocks/cells

Supports 2700 logic elements

40,960 total RAM bits

140 configurable I/O pins

100,000 gates

Product Performance

Operates between 2.375V and 2.625V

Can function in temperatures ranging from 0°C to 85°C

Technical Specifications

Voltage Supply: 2.375V ~ 2.625V

Number of Gates: 100,000

Number of Logic Elements/Cells: 2700

Total RAM Bits: 40,960

Number of I/O: 140

Dimensions, Shape, and Packaging

Package / Case: 208-BFQFP

Dimensions: 28x28 mm PQFP

Quality and Reliability

Robust surface mount package

Designed for a wide range of operating temperatures

Product Advantages

High gate density

Flexible logic integration

Extensive I/O capabilities

Product Competitiveness

High performance in a compact form factor

Competes well in embedded applications requiring high-speed logic operations

Compatibility

Compatible with various logic design and simulation tools offered by Xilinx and other vendors

Standard Certification and Compliance

Complies with industry standard voltage and temperature specifications

Lifespan and Sustainability

Designed for long-term deployment in embedded systems

Robust physical and operational design ensures extended product lifecycle

Actual Application Fields

Used in telecommunications, automotive, defense, and consumer electronics industries for complex digital integrations

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