TMPA2010DMCR
Part Number TMPA2010DMCR
Manufacturer TAI
Description TMPA2010DMCR TAI
Quantity Available 2677 pcs new original in stock.
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Datasheets TMPA2010DMCR.pdf
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Technical Information of TMPA2010DMCR
Manufacturer Part Number TMPA2010DMCR Category Integrated Circuits (ICs)
Manufacturer TAI Description TMPA2010DMCR TAI
Package / Case Quantity Available 2677 pcs
Package BGA Condtion New Original Stock
Warranty 100% Perfect Functions Lead Time 2-3days after payment.
Payment PayPal / Telegraphic Transfer / Western Union Shipping by DHL / Fedex / UPS
Port HongKong RFQ Email
DownloadTMPA2010DMCR PDF - DE.pdfTMPA2010DMCR PDF - FR.pdfTMPA2010DMCR PDF - ES.pdfTMPA2010DMCR PDF - IT.pdfTMPA2010DMCR PDF - KR.pdf

Product Model

TMPA2010DMCR

Introduction

Integrated Circuit for Specialized Applications

Brand and Manufacturer

TAI

Features

BGA package for efficient heat dissipation

Designed for specialized electronic functions

Optimized for high integration and miniaturization

Product Performance

Stable operation under a wide range of conditions

High performance with low power consumption

Technical Specifications

IC type: Specialized

Package type: Ball Grid Array (BGA)

Dimensions, Shape, and Packaging

Compact BGA footprint

Supplied in tape and reel for automated assembly

Quality and Reliability

Built to stringent quality standards

Proven reliability in various applications

Product Advantages

Enhanced functional density

Reduces the need for additional components

Product Competitiveness

Competitive in specialized IC markets

Optimized for specific application needs

Compatibility

Designed to be compatible with standard BGA mounting processes

Standard Certification and Compliance

Meets industry-standard certification requirements

Lifespan and Sustainability

Long operational lifespan

Designed with sustainability considerations

Actual Application Fields

Used in specialized electronics across various industries

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