74CBT3245 | |
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Part Number | 74CBT3245 |
Manufacturer | N/A |
Description | 74CBT3245 TI |
Quantity Available | 2566 pcs new original in stock. Request Stock & Quotation |
ECAD Model | |
Datasheets | 74CBT3245.pdf |
Download | 74CBT3245 Details PDF |
74CBT3245 Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
Technical Information of 74CBT3245 | |||
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Manufacturer Part Number | 74CBT3245 | Category | Integrated Circuits (ICs) |
Manufacturer | N/A | Description | 74CBT3245 TI |
Package / Case | Quantity Available | 2566 pcs | |
Package | SOP20 | Condtion | New Original Stock |
Warranty | 100% Perfect Functions | Lead Time | 2-3days after payment. |
Payment | PayPal / Telegraphic Transfer / Western Union | Shipping by | DHL / Fedex / UPS |
Port | HongKong | RFQ Email | |
Download | 74CBT3245 PDF - DE.pdf |
74CBT3245
Octal bus transceiver with 3-state outputs
Texas Instruments (TI)
Bidirectional interface between two ports
Eight 3-state outputs for bus-oriented communication
25-Ohm series resistors in the outputs
5-V tolerant inputs and outputs
High-speed with 5-volt tolerant Transceiver
Low-power consumption
Controlled output transitions for reduced signal disturbance
Latch-up performance exceeds 250 mA per JESD 78
I/O Voltage range: 4.5 V to 5.5 V
Maximum Data Rates: up to 240 Mbps
Pin count: 20
Rectangular, Surface-Mount SOIC package
Dimensions: 8.65 mm x 3.9 mm (Length x Width)
Packed in tape and reel for automated assembly
Operating temperature range from -40°C to 85°C
Statistical quality control with high processing yields
Meets or exceeds industry standards for quality
High-speed data transfer capabilities
Interface level translation functionality (5V to 3.3V logic)
Industry-standard pin configuration
Optimized for networking and telecommunication
Compatible with various microcontrollers and processors
Supports hot-insertion and hot-removal
Complies with JEDEC standard no. 7A
ESD protection exceeds JESD 22
RoHS compliant
High-reliability design for an extended lifespan
Manufactured with "Green" molding compounds
Telecommunications switching systems
Computing peripheral devices
Data acquisition and signal processing
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