Product Model

H5TQ4G63EFR-TEC

Introduction

A specialized Integrated Circuit (IC) designed for high-speed memory applications.

Brand and Manufacturer

SK HYNIX

Features

High data transfer rate

Low power consumption

Large storage capacity

Advanced manufacturing process

Product Performance

Reliable data integrity

Superior thermal performance

High-speed operation

Extended temperature range support

Technical Specifications

DDR3 SDRAM

4Gb density

TSV (Through Silicon Via) technology

Dimensions, Shape, and Packaging

Small form factor

Standard IC packaging suitable for surface mounting

Packaged in trays or tape and reel for automatic assembly

Quality and Reliability

Stringent quality control

Robust against environmental conditions

Proven field reliability

Product Advantages

Built by a trusted industry leader

High-speed data capabilities

Energy-efficient design

Product Competitiveness

Cost-effective solution for memory-intensive applications

Competes with top-tier memory products

Compatibility

Compatible with standard DDR3 SDRAM interfaces

Works with a broad range of microprocessors and controllers

Standard Certification and Compliance

Meets applicable JEDEC standards

Compliant with RoHS regulations

Lifespan and Sustainability

Long operational lifespan

Designed for continuous usage

Actual Application Fields

Personal Computers

Servers

Networking equipment

Telecommunication systems

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