GS8161Z32DGD-150
Part Number GS8161Z32DGD-150
Manufacturer GSI
Description GSI BGA13X15
Quantity Available 572 pcs new original in stock.
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Technical Information of GS8161Z32DGD-150
Manufacturer Part Number GS8161Z32DGD-150 Category Integrated Circuits (ICs)
Manufacturer GSI Description GSI BGA13X15
Package / Case BGA13X15 Quantity Available 572 pcs
Condtion New Original Stock Warranty 100% Perfect Functions
Lead Time 2-3days after payment. Payment PayPal / Telegraphic Transfer / Western Union
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Product Model

GS8161Z32DGD-150

Introduction

High-speed synchronous SRAM Integrated Circuit

Brand and Manufacturer

GSI Technology

Features

Synchronous operation

Differential Data Strobe (DQS)

2-word burst for reducing address bus frequency

ZQ calibration for output impedance matching

JTAG support for testing and programming

Echo Clock for data outputs synchronization

Product Performance

High-speed access and cycle times

Stable and high-frequency operation

Low latency and increased data throughput

Technical Specifications

32Mb memory density

150 MHz clock frequency

3V power supply voltage

5V I/O supply voltage

Flow-through or pipelined output

Dimensions, Shape, and Packaging

FBGA package

Ball grid array for efficient space utilization

Standard industry dimensions for compatibility

Quality and Reliability

Built to industry standards for SRAM ICs

Robust against environmental variations

Tested across temperature ranges for performance

Product Advantages

Increased data bandwidth for high-performance computing

Reliable in various operating conditions

Includes features to simplify system design

Product Competitiveness

Competes with other high-speed SRAM offerings

Balanced performance and power consumption

Compatibility

Works with standard SRAM sockets and interfaces

Compatible with various microprocessors and DSPs

Standard Certification and Compliance

Complies with JEDEC standards for integrated circuits

RoHS compliant for restricted hazardous substances

Lifespan and Sustainability

Designed for long-term reliability

Eco-friendly materials for reduced environmental impact

Actual Application Fields

Suitable for networking and telecommunications

High-performance computing applications

Embedded systems requiring fast memory access

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