| BCM3563XKFEB5G | |
|---|---|
| Part Number | BCM3563XKFEB5G |
| Manufacturer | BCM |
| Description | BCM3563XKFEB5G BCM |
| Quantity Available | 2979 pcs new original in stock. Request Stock & Quotation |
| ECAD Model | |
| Datasheets | BCM3563XKFEB5G.pdf |
| Download | BCM3563XKFEB5G Details PDF |
| BCM3563XKFEB5G Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
| Technical Information of BCM3563XKFEB5G | |||
|---|---|---|---|
| Manufacturer Part Number | BCM3563XKFEB5G | Category | Integrated Circuits (ICs) |
| Manufacturer | BCM | Description | BCM3563XKFEB5G BCM |
| Package / Case | Quantity Available | 2979 pcs | |
| Package | BGA | Condtion | New Original Stock |
| Warranty | 100% Perfect Functions | Lead Time | 2-3days after payment. |
| Payment | PayPal / Telegraphic Transfer / Western Union | Shipping by | DHL / Fedex / UPS |
| Port | HongKong | RFQ Email | |
| Download | BCM3563XKFEB5G PDF - DE.pdfBCM3563XKFEB5G PDF - FR.pdfBCM3563XKFEB5G PDF - ES.pdfBCM3563XKFEB5G PDF - IT.pdfBCM3563XKFEB5G PDF - KR.pdf | ||
Product Model
BCM3563XKFEB5G
Introduction
Specialized Integrated Circuit for Advanced Applications
Brand and Manufacturer
BCM
Features
High-performance processing capabilities
Advanced signal management
Low power consumption
Integrated functionality for streamlined design
Product Performance
Optimized for high-speed data transmission
Robust error correction features
Enhanced thermal management for reliability
Technical Specifications
Type: Integrated Circuit
Category: Specialized ICs
Package: BGA
Dimensions, Shape, and Packaging
Compact Ball Grid Array package
Designed for dense circuit board layouts
Standardized packaging for secure transport and storage
Quality and Reliability
Meets rigorous industry standards
High-quality materials for durability
Stringent quality control processes
Product Advantages
Superior processing speed
High integration reduces system complexity
Energy-efficient design
Product Competitiveness
Competitive in high-performance IC markets
Well-positioned among leading technology solutions
Favorable cost-performance ratio
Compatibility
Compatible with standard BGA socket configurations
Interoperable with various electronic components and systems
Standard Certification and Compliance
Complies with major international safety and performance standards
Certified for electronic industry compliance
Lifespan and Sustainability
Designed for long-term operation
Built with eco-friendly materials
Recyclable packaging and components
Actual Application Fields
Telecommunications
Computing devices
High-tech industrial applications
Email us: Info@Ariat-Tech.com or RFQ BCM3563XKFEB5G Online.
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| BCM3563XKFEB5G Datasheet | Download BCM3563XKFEB5G Datasheet | Manufacturer |
